Global Patent Index - EP 0626463 B1

EP 0626463 B1 20000712 - Heat- and creepresisting steel with martensitic structure, obtained by a thermal treatment process

Title (en)

Heat- and creepresisting steel with martensitic structure, obtained by a thermal treatment process

Title (de)

Hitze- und kriechbeständiger Stahl mit einem durch einen Vergütungsprozess erzeugten martensitischen Gefüge

Title (fr)

Acier résistant aux températures élévées et au fluage, présentant une structure martensitique obtenue par un traitement thermique

Publication

EP 0626463 B1 20000712 (DE)

Application

EP 94107344 A 19940511

Priority

CH 160693 A 19930528

Abstract (en)

[origin: US5415706A] The heat- and creep-resistant steel has a martensitic microstructure produced by a heat-treatment process. The composition of the steel in percent by weight is as follows: 0.001-0.05 of carbon 0.05-0.5 of silicon 0.05-2.0 of manganese 0.05-2.0 of nickel 8.0-13.0 of chromium 0.05-1.0 of molybdenum 1.00-4.0 of tungsten 0.05-0.5 of vanadium 0.01-0.2 of niobium 2.0-6.5 of cobalt 0.1-0.3 of nitrogen, the remainder being iron and unavoidable impurities. Such a steel can be produced by forging, casting or by powder-metallurgical means. Components fabricated from this steel show a high strength and ductility at room temperature and are distinguished at temperatures of 600 DEG C. and higher by a very high creep strength and an unusually high oxidation resistance. They can therefore be used with advantage as mechanically and thermally highly stressed components in steam- and/or gas-operated power stations.

IPC 1-7

C22C 38/52

IPC 8 full level

C22C 38/00 (2006.01); C22C 38/30 (2006.01); C22C 38/52 (2006.01); C22C 38/58 (2006.01)

CPC (source: EP US)

C22C 38/001 (2013.01 - EP US); C22C 38/30 (2013.01 - EP US); C22C 38/52 (2013.01 - EP US)

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

US 5415706 A 19950516; CN 1037361 C 19980211; CN 1098444 A 19950208; DE 59409428 D1 20000817; EP 0626463 A1 19941130; EP 0626463 B1 20000712; JP 3422561 B2 20030630; JP H07138711 A 19950530

DOCDB simple family (application)

US 23941394 A 19940506; CN 94106160 A 19940527; DE 59409428 T 19940511; EP 94107344 A 19940511; JP 10999194 A 19940524