Global Patent Index - EP 0627797 B1

EP 0627797 B1 19981125 - System of printed circuit boards

Title (en)

System of printed circuit boards

Title (de)

System von Leiterplatten

Title (fr)

Système de circuits imprimés

Publication

EP 0627797 B1 19981125 (EN)

Application

EP 94201555 A 19940603

Priority

NL 9300970 A 19930604

Abstract (en)

[origin: EP0627797A1] Method for manufacturing contact elements from a strip of conductive material, wherein successive contact elements are formed in the strip by cutting away parts between the successive contact elements. Each contact element is made with a contact means with opposite contact faces for contacting a complementary contact element. The contact means of each contact element includes a twisted portion in such a manner that the contact means is twisted along an angle of substantially 90 DEG with respect to the plane of the material strip. <IMAGE>

IPC 1-7

H01R 43/16; H01R 9/09

IPC 8 full level

H01R 43/16 (2006.01)

CPC (source: EP)

H01R 43/16 (2013.01); H01R 12/585 (2013.01)

Designated contracting state (EPC)

BE FR SE

DOCDB simple family (publication)

EP 0627797 A1 19941207; EP 0627797 B1 19981125; NL 9300970 A 19950102

DOCDB simple family (application)

EP 94201555 A 19940603; NL 9300970 A 19930604