EP 0627797 B1 19981125 - System of printed circuit boards
Title (en)
System of printed circuit boards
Title (de)
System von Leiterplatten
Title (fr)
Système de circuits imprimés
Publication
Application
Priority
NL 9300970 A 19930604
Abstract (en)
[origin: EP0627797A1] Method for manufacturing contact elements from a strip of conductive material, wherein successive contact elements are formed in the strip by cutting away parts between the successive contact elements. Each contact element is made with a contact means with opposite contact faces for contacting a complementary contact element. The contact means of each contact element includes a twisted portion in such a manner that the contact means is twisted along an angle of substantially 90 DEG with respect to the plane of the material strip. <IMAGE>
IPC 1-7
IPC 8 full level
H01R 43/16 (2006.01)
CPC (source: EP)
H01R 43/16 (2013.01); H01R 12/585 (2013.01)
Designated contracting state (EPC)
BE FR SE
DOCDB simple family (publication)
EP 0627797 A1 19941207; EP 0627797 B1 19981125; NL 9300970 A 19950102
DOCDB simple family (application)
EP 94201555 A 19940603; NL 9300970 A 19930604