EP 0633129 B1 19990901 - SHEET LAMINATE MOLDING METHOD AND APPARATUS
Title (en)
SHEET LAMINATE MOLDING METHOD AND APPARATUS
Title (de)
VERFAHREN UND VORRICHTUNG ZUM FORMEN VON VERBUNDFOLIEN
Title (fr)
PROCEDE ET APPAREIL DE MOULAGE DE STRATIFIE EN FEUILLES
Publication
Application
Priority
- JP 9301567 W 19931028
- JP 31411192 A 19921028
- JP 2739793 A 19930121
Abstract (en)
[origin: EP0633129A1] A first plastic film (90) cut into an effective region (V1) constituting a three-dimensional object and unnecessary regions (U1) not constituting three-dimensional objects is provided, and a second plastic film (94) is supplied to a position above the first plastic film (90). A photosetting bonding agent (96) is applied to the lower surface of the second plastic film (94), and the portions (96a) corresponding to the sum of the unnecessary regions (U1, U2) of the first and second plastic films are cured with the other portion (96b) left uncured. The first and second plastic films are then bonded to each other by applying light to the uncured layer (96b) so as to cure the same. The second plastic film (94) is then cut into an effective region (V2) and unnecessary regions (U2). By repeating these steps, plastic films are laminated in order, to mold a three-dimensional object. <IMAGE>
IPC 1-7
IPC 8 full level
B29C 65/48 (2006.01); B29C 67/00 (2006.01)
CPC (source: EP US)
B29C 64/141 (2017.08 - EP); B29C 64/147 (2017.08 - EP US); B29C 64/188 (2017.08 - EP); B33Y 10/00 (2014.12 - EP US); B33Y 30/00 (2014.12 - EP US); Y10T 156/108 (2015.01 - EP US); Y10T 156/1317 (2015.01 - EP US); Y10T 156/1343 (2015.01 - EP US)
Designated contracting state (EPC)
AT BE CH DE DK FR GB IT LI LU NL SE
DOCDB simple family (publication)
EP 0633129 A1 19950111; EP 0633129 A4 19950830; EP 0633129 B1 19990901; AT E183961 T1 19990915; DE 69326239 D1 19991007; JP H06190929 A 19940712; JP H0761686 B2 19950705; US 5578155 A 19961126; WO 9409971 A1 19940511
DOCDB simple family (application)
EP 93923662 A 19931028; AT 93923662 T 19931028; DE 69326239 T 19931028; JP 2739793 A 19930121; JP 9301567 W 19931028; US 25610794 A 19940627