EP 0633950 A1 19950118 - NICKEL-FREE PHOSPHATIZATION PROCESS.
Title (en)
NICKEL-FREE PHOSPHATIZATION PROCESS.
Title (de)
NICKELFREIE PHOSPHATIERVERFAHREN.
Title (fr)
PROCEDE DE PHOSPHATATION EXEMPTE DE NICKEL.
Publication
Application
Priority
- DE 4210513 A 19920331
- EP 9202827 W 19921207
Abstract (en)
[origin: WO9320259A1] The invention concerns a process for the manufacture of copper-containing nickel-free phosphate films, with a defined copper content and a defined phosphate-crystal edge length, on metal surfaces, using phosphatization solutions which, in addition to zinc, copper and phosphate ions, contain hydroxylammonium salts, hydroxylamine complexes and/or hydroxylamine as accelerators.
IPC 1-7
IPC 8 full level
B05D 3/10 (2006.01); B05D 7/14 (2006.01); C23C 22/08 (2006.01); C23C 22/12 (2006.01); C23C 22/17 (2006.01); C23C 22/18 (2006.01); C23C 22/22 (2006.01); C23C 28/00 (2006.01)
CPC (source: EP US)
C23C 22/12 (2013.01 - EP US); C23C 22/186 (2013.01 - EP US); C23C 22/22 (2013.01 - EP US); C23C 22/80 (2013.01 - EP); Y10T 428/12583 (2015.01 - EP US)
Citation (search report)
See references of WO 9320259A1
Designated contracting state (EPC)
AT BE DE ES FR GB IT NL PT SE
DOCDB simple family (publication)
WO 9320259 A1 19931014; AT E138112 T1 19960615; CA 2133455 A1 19931014; DE 4210513 A1 19931007; DE 59206327 D1 19960620; EP 0633950 A1 19950118; EP 0633950 B1 19960515; ES 2086782 T3 19960701; JP H07505445 A 19950615; US 6197126 B1 20010306
DOCDB simple family (application)
EP 9202827 W 19921207; AT 92924684 T 19921207; CA 2133455 A 19921207; DE 4210513 A 19920331; DE 59206327 T 19921207; EP 92924684 A 19921207; ES 92924684 T 19921207; JP 51700792 A 19921207; US 31317994 A 19940930