Global Patent Index - EP 0635035 A4

EP 0635035 A4 19960313 - A HIGH PERFORMANCE EPOXY BASED LAMINATING ADHESIVE.

Title (en)

A HIGH PERFORMANCE EPOXY BASED LAMINATING ADHESIVE.

Title (de)

HOCH LEISTUNGSVERBUNDKLEBSTOFF AUF DER BASIS VON EINEM EPOXYDHARZ.

Title (fr)

ADHESIF STRATIFIE HAUTE PERFORMANCE A BASE D'EPOXY.

Publication

EP 0635035 A4 19960313 (EN)

Application

EP 93909150 A 19930406

Priority

  • US 9302677 W 19930406
  • US 86298392 A 19920406

Abstract (en)

[origin: WO9320123A1] A process for producing an improved three-dimensional polymeric adhesive material comprises: (1) reacting a starting polymer containing an active hydrogen or hydroxy function with a polyfunctional nucleophile to form an adduct product; and (2) reacting the adduct product with a polyelectrophile to generate a three-dimensional polymeric adhesive material. Preferably, the starting polymer is a high molecular weight polyester, the polyfunctional nucleophile is a polyisocyanate, and the polyelectrophile is at least one polyepoxide. The present invention also encompasses processes for bonding at least two substrates by generating the adhesive material between them, as well as the adhesive material itself. The invention is particularly suitable for bonding electronic components such as printed circuit boards.

IPC 1-7

C08G 63/48; B32B 15/08

IPC 8 full level

B32B 15/08 (2006.01); C08G 18/40 (2006.01); C08G 18/83 (2006.01); C09J 163/00 (2006.01); C09J 175/04 (2006.01); C09J 175/06 (2006.01); C09J 201/00 (2006.01); C09J 201/02 (2006.01); H05K 3/38 (2006.01)

CPC (source: EP)

C08G 18/4045 (2013.01); C08G 18/831 (2013.01); C08L 63/00 (2013.01); C08L 75/04 (2013.01); C09J 163/00 (2013.01); C09J 175/04 (2013.01); C09J 175/06 (2013.01); H05K 3/386 (2013.01)

Citation (search report)

  • [X] EP 0304026 A1 19890222 - FULLER H B CO [US]
  • [X] GB 1197794 A 19700708 - DOW CHEMICAL CO [US]
  • [X] GB 1120514 A 19680717 - STANDARD PRODUCTS CO
  • [A] EP 0346008 A2 19891213 - LORD CORP [US]
  • [X] CHEMICAL ABSTRACTS, vol. 116, no. 2, July 1992, Columbus, Ohio, US; abstract no. 84969x, GADESKI ET AL: "HIGH-PERFORMANCE EPOXY-BASED LAMINATING ADHESIVE" page 57; & CA 2004130 A1 19910529 - GARDESKI THOMAS F [US]
  • [X] CHEMICAL ABSTRACTS, vol. 115, no. 2, July 1991, Columbus, Ohio, US; abstract no. 10078p, HALASA: "URETHANE-MODIFIED EPOXY RESINS" page 52; & POLIMERY, vol. 34, no. 12, WARSAW,POLAND, pages 527 - 531
  • [A] CHEMICAL ABSTRACTS, vol. 81, no. 14, 7 October 1974, Columbus, Ohio, US; abstract no. 78704z, WATANABE ET AL: "ADHESIVE COMPOSITIONS FOR FLEXIBLE ELECTRIC CIRCUIT" page 35; column 1; & JP H04922440 A
  • See references of WO 9320123A1

Designated contracting state (EPC)

AT BE CH DE DK ES FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

WO 9320123 A1 19931014; CA 2133839 A1 19931014; EP 0635035 A1 19950125; EP 0635035 A4 19960313; JP H07509010 A 19951005

DOCDB simple family (application)

US 9302677 W 19930406; CA 2133839 A 19930406; EP 93909150 A 19930406; JP 51752393 A 19930406