EP 0636277 A1 19950201 - REACTION RESINS FOR POTTING PRESSURE-SENSITIVE ELECTRONIC COMPONENTS.
Title (en)
REACTION RESINS FOR POTTING PRESSURE-SENSITIVE ELECTRONIC COMPONENTS.
Title (de)
REAKTIONSHARZE ZUM VERGIESSEN VON DRUCKEMPFINDLICHEN ELEKTRONISCHEN BAUELEMENTEN.
Title (fr)
RESINES DE REACTION POUR L'ENROBAGE DE COMPOSANTS ELECTRONIQUES SENSIBLES A LA PRESSION.
Publication
Application
Priority
- DE 9300247 W 19930317
- DE 4211250 A 19920403
Abstract (en)
[origin: WO9320585A1] For the potting of pressure-sensitive electronic components, the invention proposes that an epoxy/anhydride reaction-resin system with a high glass-transition temperature be modified with finely dispersed silicon-rubber particles and a vitreous fused silica filler with the optimum particle-size distribution in order to improve the modulus of elasticity, crack resistance and resistance to changes in temperature, while maintaining the resistance to moisture and chemicals at the same level.
IPC 1-7
IPC 8 full level
C08G 59/32 (2006.01); C08L 63/00 (2006.01); H01B 3/40 (2006.01); H01L 23/24 (2006.01); H01L 23/29 (2006.01)
CPC (source: EP KR)
C08G 59/32 (2013.01 - EP); C08L 63/00 (2013.01 - EP); H01B 3/40 (2013.01 - EP); H01L 23/24 (2013.01 - EP); H01L 23/29 (2013.01 - KR); H01L 23/293 (2013.01 - EP); H01L 2924/0002 (2013.01 - EP)
Citation (search report)
See references of WO 9320585A1
Designated contracting state (EPC)
DE ES FR GB IT
DOCDB simple family (publication)
WO 9320585 A1 19931014; DE 4211250 A1 19931007; EP 0636277 A1 19950201; KR 950701140 A 19950220
DOCDB simple family (application)
DE 9300247 W 19930317; DE 4211250 A 19920403; EP 93906430 A 19930317; KR 19940703476 A 19941004