Title (en)

Upgradable multi-chip module.

Title (de)

Verbesserter Mehrchipmodul.

Title (fr)

Module multichip amélioré.

Publication

EP 0637079 A1 19950201 (EN)

Application

EP 94303974 A 19940602

Priority

US 9974093 A 19930730

Abstract (en)

A substrate, an alignment plate, a heat sink, a back plate, a plurality of spacers, and a plurality of nuts are used to removably package a number of semiconductor packages into a single module. The semiconductor dies are packaged with TAB packages having LGA outer lead bumps. The substrate comprises a number of land patterns, a number of alignment cavities, and a number of join cavities. The alignment plate is fabricated with a number of alignment pins, a number of housing cavities, and a number of join cavities. The heat sink is fabricated with a number of stems and a number of join cavities. The back plate is fabricated with a number of extrusions having threaded ends. The spacers are fabricated with flanged openings at both ends, and each spacer is loaded with a number of spring washers. The nuts are fabricated with stepped heads. The extrusions, the land patterns and the alignment and join cavities of the substrate, the alignment pins and the housing and join cavities of the alignment plate, the stems and the join cavities of the heat sink, the spring washer loaded spacers, and the stepped head nuts are coordinated in their numbers, sizes and geometric locations. As a result, the semiconductor packages may be easily replaced at a later time with enhanced versions, and the replaced semiconductor packages are salvageable. <IMAGE>

IPC 1-7

H01L 23/40; H05K 7/20

IPC 8 full level

B23P 21/00 (2006.01); H01L 23/40 (2006.01); H01L 25/065 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/36 (2006.01); H05K 7/20 (2006.01)

CPC (source: EP KR)

H01L 23/02 (2013.01 - KR); H01L 23/4006 (2013.01 - EP); H01L 25/0655 (2013.01 - EP); H01L 2023/4043 (2013.01 - EP); H01L 2023/4062 (2013.01 - EP); H01L 2023/4081 (2013.01 - EP); H01L 2023/4087 (2013.01 - EP); H01L 2224/16 (2013.01 - EP); H01L 2924/09701 (2013.01 - EP)

Citation (search report)

• [XA] US 4169642 A 19791002 - MOUISSIE BOB [NL]
• [XA] US 4933808 A 19900612 - HORTON ROALD N [US], et al
• [XA] US 5065280 A 19911112 - KARNEZOS MARCOS [US], et al
• [A] DE 3509734 A1 19850919 - TEKTRONIX INC [US]
• [A] EP 0462552 A1 19911227 - NEC CORP [JP]
• [XA] "Flexible module carrier direct connection package", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 28, no. 7, December 1985 (1985-12-01), NEW YORK US, pages 2855 - 2856

Designated contracting state (EPC)

DE FR GB NL

DOCDB simple family (publication)

EP 0637079 A1 19950201; JP H0779059 A 19950320; KR 960015863 A 19960522

DOCDB simple family (application)

EP 94303974 A 19940602; JP 19271594 A 19940726; KR 19940016556 A 19940709