EP 0644806 A1 19950329 - MULTIPIN STRUCTURES.
Title (en)
MULTIPIN STRUCTURES.
Title (de)
Mehrstiftestruktur.
Title (fr)
STRUCTURES MULTIBROCHES.
Publication
Application
Priority
- GB 9301265 W 19930614
- GB 9212674 A 19920615
Abstract (en)
[origin: WO9325332A1] A heat sink comprises a thick base plate (1), a plurality of parallel pins (2) running outwardly from the base plate and spaced close to each other to define a labyrinthine air path, and a guide plate (3) in which an axial fan (4) is mounted to direct air parallel to the pins towards the base plate (1) which is mounted on the object to be cooled. The heat sink is produced by solidifying a mould (15) of resin coated sand around a tool (11-14), then withdrawing the tool, then gravity die casting through the mould, then destroying the mould.
IPC 1-7
IPC 8 full level
F28F 13/02 (2006.01); B22C 7/00 (2006.01); B22C 9/02 (2006.01); B22C 9/22 (2006.01); B22C 9/24 (2006.01); B22D 19/00 (2006.01); B22D 25/02 (2006.01); F28F 3/02 (2006.01); F28F 3/04 (2006.01); H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 23/467 (2006.01)
CPC (source: EP)
B22C 9/24 (2013.01); B22D 19/0063 (2013.01); B22D 25/02 (2013.01); F28F 3/022 (2013.01); F28F 3/048 (2013.01); H01L 23/3677 (2013.01); H01L 2924/0002 (2013.01)
C-Set (source: EP)
Citation (search report)
See references of WO 9325332A1
Designated contracting state (EPC)
AT BE DE DK FR GB IT NL SE
DOCDB simple family (publication)
WO 9325332 A1 19931223; AU 4346993 A 19940104; EP 0644806 A1 19950329; GB 9212674 D0 19920729; JP H07507726 A 19950831
DOCDB simple family (application)
GB 9301265 W 19930614; AU 4346993 A 19930614; EP 93913366 A 19930614; GB 9212674 A 19920615; JP 50129693 A 19930614