EP 0645810 A4 19970416 - PACKAGE FOR SEMICONDUCTOR CHIP.
Title (en)
PACKAGE FOR SEMICONDUCTOR CHIP.
Title (de)
PACKUNG FÜR HALBLEITERCHIP.
Title (fr)
BOITIER POUR PUCE DE SEMICONDUCTEUR.
Publication
Application
Priority
- JP 7967593 A 19930406
- JP 31538293 A 19931215
- JP 9400571 W 19940406
Abstract (en)
[origin: WO9423448A1] A package for a semiconductor chip having the following features: (a) a power-supply layer, a ground layer, and a signal layer are formed in multilayer through intermediate layers including insulating layers; (b) the power-supply layer and ground layer each comprise an inner lead region exposed from the intermediate layers, an outer lead region, and a conductive region sandwiched by these two regions and covered by the intermediate layers; and (c) the conductive regions of the power-supply layer and ground layer consist of planar conductive members. The self-inductances of the power-supply and ground layers of this package are low, and the capacitance of the capacitor formed by these layers is low. Therefore, the noise of the power-supply system is little.
IPC 1-7
IPC 8 full level
H01L 23/057 (2006.01); H01L 23/367 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01)
CPC (source: EP KR US)
H01L 23/04 (2013.01 - KR); H01L 23/057 (2013.01 - EP US); H01L 23/3675 (2013.01 - EP US); H01L 23/49537 (2013.01 - EP US); H01L 23/49822 (2013.01 - EP US); H01L 23/50 (2013.01 - EP US); H01L 24/49 (2013.01 - EP US); H01L 24/45 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/2919 (2013.01 - EP US); H01L 2224/29339 (2013.01 - EP US); H01L 2224/45015 (2013.01 - EP US); H01L 2224/45124 (2013.01 - EP US); H01L 2224/45144 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2224/48257 (2013.01 - EP US); H01L 2224/49109 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2224/85099 (2013.01 - EP US); H01L 2224/85203 (2013.01 - EP US); H01L 2224/85205 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01007 (2013.01 - EP US); H01L 2924/01012 (2013.01 - EP US); H01L 2924/01014 (2013.01 - EP US); H01L 2924/01015 (2013.01 - EP US); H01L 2924/01018 (2013.01 - EP US); H01L 2924/01019 (2013.01 - EP US); H01L 2924/01022 (2013.01 - EP US); H01L 2924/01023 (2013.01 - EP US); H01L 2924/01027 (2013.01 - EP US); H01L 2924/01028 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/0103 (2013.01 - EP US); H01L 2924/01031 (2013.01 - EP US); H01L 2924/01032 (2013.01 - EP US); H01L 2924/0104 (2013.01 - EP US); H01L 2924/01041 (2013.01 - EP US); H01L 2924/01042 (2013.01 - EP US); H01L 2924/01043 (2013.01 - EP US); H01L 2924/01044 (2013.01 - EP US); H01L 2924/01045 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/0105 (2013.01 - EP US); H01L 2924/01051 (2013.01 - EP US); H01L 2924/01057 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01059 (2013.01 - EP US); H01L 2924/0106 (2013.01 - EP US); H01L 2924/01061 (2013.01 - EP US); H01L 2924/01063 (2013.01 - EP US); H01L 2924/01064 (2013.01 - EP US); H01L 2924/01065 (2013.01 - EP US); H01L 2924/01066 (2013.01 - EP US); H01L 2924/01067 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/0107 (2013.01 - EP US); H01L 2924/01072 (2013.01 - EP US); H01L 2924/01073 (2013.01 - EP US); H01L 2924/01074 (2013.01 - EP US); H01L 2924/01075 (2013.01 - EP US); H01L 2924/01076 (2013.01 - EP US); H01L 2924/01077 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01083 (2013.01 - EP US); H01L 2924/01322 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/07802 (2013.01 - EP US); H01L 2924/09701 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/12044 (2013.01 - EP US); H01L 2924/15153 (2013.01 - EP US); H01L 2924/1517 (2013.01 - EP US); H01L 2924/15787 (2013.01 - EP US); H01L 2924/16152 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); H01L 2924/19041 (2013.01 - EP US); H01L 2924/20102 (2013.01 - EP US); H01L 2924/20753 (2013.01 - EP US); H01L 2924/30107 (2013.01 - EP US); H01L 2924/3011 (2013.01 - EP US)
Citation (search report)
- [X] EP 0457592 A2 19911121 - SHINKO ELECTRIC IND CO [JP]
- [X] US 5008734 A 19910416 - DUTTA VIVEK B [US], et al
- [XA] GB 2199988 A 19880720 - INTEL CORP
- [X] PATENT ABSTRACTS OF JAPAN vol. 017, no. 238 (E - 1363) 13 May 1993 (1993-05-13)
- [XA] PATENT ABSTRACTS OF JAPAN vol. 016, no. 288 (E - 1223) 25 June 1992 (1992-06-25)
- See references of WO 9423448A1
Designated contracting state (EPC)
DE GB
DOCDB simple family (publication)
WO 9423448 A1 19941013; EP 0645810 A1 19950329; EP 0645810 A4 19970416; KR 950702068 A 19950517; US 5629559 A 19970513
DOCDB simple family (application)
JP 9400571 W 19940406; EP 94912058 A 19940406; KR 19940704399 A 19941202; US 34748494 A 19941206