Global Patent Index - EP 0653109 A1

EP 0653109 A1 19950517 - MODULAR PANEL FOR MAKING A CONDUCTOR NETWORK, ASSOCIATED CONNECTORS, AND METHODS FOR FABRICATING SUCH PANELS.

Title (en)

MODULAR PANEL FOR MAKING A CONDUCTOR NETWORK, ASSOCIATED CONNECTORS, AND METHODS FOR FABRICATING SUCH PANELS.

Title (de)

MODULPLATTE FÜR DIE AUSFÜHRUNG EINES LEITERNETZES,DAZUGEHÖRIGE VERBINDER UND VERFAHREN ZUR HERSTELLUNG DER PLATTEN.

Title (fr)

PANNEAU MODULAIRE POUR LA REALISATION D'UN RESEAU CONDUCTEUR, CONNECTEURS ASSOCIES, ET PROCEDES DE FABRICATION DES PANNEAUX.

Publication

EP 0653109 A1 19950517 (FR)

Application

EP 93917841 A 19930729

Priority

  • FR 9300780 W 19930729
  • FR 9209353 A 19920729

Abstract (en)

[origin: FR2694322A1] Modular panel for making a conductor network comprising at least three layers (24, 26, 28) of insulating material and at least two layers (20, 22) of conducting material separated by the insulating material layers, the panel being designed to receive at least one apparatus (10) fitted with penetrating connection pins (14, 16) each provided with at least one conducting area, whose length and number are adapted to the conductive layers to be reached, the panel being characterized in that it is comprised of a peripheral frame having elements provided with mechanical linking parts forming electric connection members, the elements of the frame being themselves connected to the corresponding layers of conducting material so as to achieve the connection between modular panels. The invention also relates to the connectors used therewith as well as to methods for fabricating such panels.

IPC 1-7

H01R 35/04

IPC 8 full level

E04C 2/52 (2006.01); H01R 4/24 (2006.01); H01R 35/04 (2006.01); H02G 3/00 (2006.01); H05K 3/40 (2006.01); H01R 11/20 (2006.01); H01R 25/14 (2006.01)

CPC (source: EP US)

E04C 2/521 (2013.01 - EP); H01R 4/2406 (2017.12 - EP US); H01R 12/67 (2013.01 - EP US); H02G 3/00 (2013.01 - EP); H01R 11/20 (2013.01 - EP); H01R 25/14 (2013.01 - EP)

Citation (search report)

See references of WO 9403947A2

Designated contracting state (EPC)

AT BE CH DE DK ES FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

FR 2694322 A1 19940204; FR 2694322 B1 19970822; AU 4712493 A 19940303; EP 0653109 A1 19950517; WO 9403947 A2 19940217; WO 9403947 A3 19940414

DOCDB simple family (application)

FR 9209353 A 19920729; AU 4712493 A 19930729; EP 93917841 A 19930729; FR 9300780 W 19930729