EP 0660406 A2 19950628 - Manufacture of semiconductor devices and novel lead frame assembly.
Title (en)
Manufacture of semiconductor devices and novel lead frame assembly.
Title (de)
Herstellung einer Halbleitervorrichtung und neuartiger Leiterrahmenaufbau.
Title (fr)
Méthode de fabrication d'un dispositif semi-conducteur et assemblage nouveau d'un cadre de connexions.
Publication
Application
Priority
US 16870693 A 19931217
Abstract (en)
The semiconductor device package includes a lead frame having cantilevered leads. Combined with the lead frame is a rigid, elongated base member having a U-shaped cross-section and laterally outwardly extending flanges at the upper ends of side walls of the base member. The leads of the lead frame overlie the base member flanges and are bonded to conductive paths on the flanges which extend along the flanges, along the base member side walls and onto the bottom wall of the base member. In use, a semiconductor chip is mounted on the bottom wall and wire bonded to respective ones of the conductive paths. Two base members can be used in flange-to-flange contacting relationship to provide a tubular enclosure for the chip.
IPC 1-7
IPC 8 full level
H01L 23/50 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01)
CPC (source: EP US)
H01L 23/49861 (2013.01 - EP US); H01L 25/0657 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 24/49 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48465 (2013.01 - EP US); H01L 2224/49171 (2013.01 - EP US); H01L 2225/0651 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/3025 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
US 5408126 A 19950418; EP 0660406 A2 19950628; EP 0660406 A3 19951108; JP H07202112 A 19950804
DOCDB simple family (application)
US 16870693 A 19931217; EP 94308918 A 19941201; JP 33286494 A 19941215