EP 0661322 A2 19950705 - Modified polyepoxy compound, process for producing the compound, and epoxy resin composition.
Title (en)
Modified polyepoxy compound, process for producing the compound, and epoxy resin composition.
Title (de)
Modifizierte Epoxyverbindung, Verfahren zur Herstellung von dieser Verbindung und eine Epoxydharzzusammensetzung.
Title (fr)
Composé epoxy modifié, procédé pour la préparation de ce composé et composition de résine epoxyde.
Publication
Application
Priority
- JP 34466793 A 19931221
- JP 15644794 A 19940616
Abstract (en)
A modified polyepoxy compound obtained by etherifying a secondary hydroxyl group of a polyepoxy compound having an alcoholic secondary hydroxyl group, such as a polyepoxy compound obtained by reaction of a bifunctional phenol compound and an epihalohydrin, or a polyepoxy compound obtained by reaction of a bifunctional phenol type epoxy compound and a bifunctional phenol compound, and an epoxy resin composition using the modified polyepoxy compound as the epoxy resin. Further, a modified brominated polyepoxy compound obtained by etherifying a secondary hydroxyl group of a polyepoxy compound having an alcoholic secondary hydroxyl group obtained by reaction of a polyepoxy compound which does not substantially contain a halogen atom and a polyhydric phenol compound having at least one bromine atom directly bonded to an aromatic ring per one molecule, and an epoxy resin composition for semiconductor encapsulation having blended therewith the modified brominated polyepoxy compound as the flame retardant.
IPC 1-7
IPC 8 full level
C07D 303/22 (2006.01); C08G 59/14 (2006.01); C08G 59/24 (2006.01); C08G 59/30 (2006.01); C08G 59/40 (2006.01); C08G 59/62 (2006.01); C08K 3/00 (2006.01); C08L 63/00 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01)
CPC (source: EP)
C08G 59/1433 (2013.01); C08G 59/245 (2013.01); C08G 59/30 (2013.01)
Designated contracting state (EPC)
BE DE FR GB IT SE
DOCDB simple family (publication)
EP 0661322 A2 19950705; EP 0661322 A3 19950816; JP H07228580 A 19950829
DOCDB simple family (application)
EP 94203710 A 19941221; JP 15644794 A 19940616