EP 0665560 A3 19970502 - Hybrid integrated circuit device.
Title (en)
Hybrid integrated circuit device.
Title (de)
Hybridschaltungsanordnung.
Title (fr)
Dispositif à circuit intégré hybride.
Publication
Application
Priority
DE 9319473 U 19931217
Abstract (en)
[origin: EP0665560A2] Hybrid switching arrangement has a resistance layer applied on one side of plate-like substrate made of glass or ceramic. A ceramic strip (6) is applied on one side of the substrate (1). Pref. the ceramic strip (6) is made of aluminium oxide, beryllium oxide or aluminium nitride, and is secured using heat conducting adhesive. The substrate (1) and strip (6) are both made of aluminium oxide and are both 1mm thick. The ceramic strip is at most 0.5 (pref. 0.1)mm thick.
IPC 1-7
IPC 8 full level
H01C 1/01 (2006.01); H01C 1/084 (2006.01); H01C 1/144 (2006.01); H01L 23/498 (2006.01)
CPC (source: EP US)
H01C 1/01 (2013.01 - EP US); H01C 1/084 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)
C-Set (source: EP US)
Citation (search report)
- [XY] US 4719443 A 19880112 - SALAY STEVEN J [US]
- [Y] US 4297670 A 19811027 - SOLOW BENJAMIN
- [YA] EP 0508615 A1 19921014 - CADDOCK ELECTRONICS INC [US]
- [Y] EP 0048938 A1 19820407 - SIEMENS AG [DE]
- [Y] US 4494104 A 19850115 - HOLMES EDWARD S B [CA]
- [PX] DE 4234022 A1 19940414 - TELEFUNKEN MICROELECTRON [DE]
- [A] EP 0465812 A1 19920115 - IBM [US]
- [A] EP 0185244 A1 19860625 - TELEFUNKEN ELECTRONIC GMBH
Designated contracting state (EPC)
AT CH DE FR GB IT LI SE
DOCDB simple family (publication)
US 5581227 A 19961203; AT E191581 T1 20000415; DE 59409274 D1 20000511; DE 9319473 U1 19940623; EP 0665560 A2 19950802; EP 0665560 A3 19970502; EP 0665560 B1 20000405
DOCDB simple family (application)
US 24220094 A 19940513; AT 94119166 T 19941205; DE 59409274 T 19941205; DE 9319473 U 19931217; EP 94119166 A 19941205