EP 0673547 A1 19950927 - ELECTRONIC PACKAGE SEALED WITH A DISPENSABLE ADHESIVE.
Title (en)
ELECTRONIC PACKAGE SEALED WITH A DISPENSABLE ADHESIVE.
Title (de)
ELEKTRONIKGEHAUSE, DAS MIT EINEM VERTEILBAREN KLEBSTOFF VERSIGELT WIRD.
Title (fr)
COMPOSANT ELECTRONIQUE SCELLE A L'AIDE D'UN ADHESIF EN DISTRIBUTEUR.
Publication
Application
Priority
- US 9311337 W 19931122
- US 98786792 A 19921209
Abstract (en)
[origin: WO9414193A1] There is provided a method for the assembly of an electronic package (48) utilizing liquid adhesives (30, 46). A first liquid adhesive (30) is dispensed on a base (12) and a leadframe (16) is supported by the liquid adhesive (30). A second liquid adhesive (46) is dispensed, overlying the first liquid adhesive (30) and the leadframe (16), and supports a cover (14). The entire assembly is then thermally cured. Means to control the flow of the liquid adhesives (52) and to reduce the mutual inductance between leads (72) are also provided.
IPC 1-7
H01L 23/48; H01L 23/02; H01L 23/12; H01L 29/44; H01L 29/52; H01L 29/60; H01L 21/60
IPC 8 full level
H01L 21/50 (2006.01); H01L 21/56 (2006.01); H01L 23/02 (2006.01); H01L 23/10 (2006.01)
CPC (source: EP)
H01L 21/50 (2013.01); H01L 23/10 (2013.01); H01L 24/49 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01039 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/163 (2013.01); H01L 2924/30107 (2013.01)
Designated contracting state (EPC)
DE FR GB IT NL
DOCDB simple family (publication)
WO 9414193 A1 19940623; AU 5616194 A 19940704; CA 2150569 A1 19940623; EP 0673547 A1 19950927; EP 0673547 A4 19960313; JP H08505266 A 19960604
DOCDB simple family (application)
US 9311337 W 19931122; AU 5616194 A 19931122; CA 2150569 A 19931122; EP 94901644 A 19931122; JP 51419393 A 19931122