EP 0681897 A1 19951115 - Resin sealing method and device.
Title (en)
Resin sealing method and device.
Title (de)
Vorrichtung und Verfahren zur Versiegelung mit Harz.
Title (fr)
Dispositif et procédé d'encapsulation par de la résine.
Publication
Application
Priority
JP 7983694 A 19940325
Abstract (en)
To reduce the amount of resin used in resin sealing in order to reduce the costs of the resin sealing process. Structure An upper die (100) and lower die (102) are placed together to form a resin sealing package die (103), on the seam of which the following are situated: a number of cavities (104) each of which is capable of holding a single semiconductor chip (CP) attached to a lead frame (LF); a pot bottom (110) that serves to press a thermosetting molding compound (resin) (12) by means of the pressing force of a pressing member such as a flange (108); and runners (114) that serve to feed the resin from the aforementioned pot bottom (110) to the individual cavities (104). To the tip of the flange (108) is attached a flexible member that is capable of contracting in the pressing direction of the aforementioned flange (108) and simultaneously expanding in the direction perpendicular to the aforementioned pressing direction, while maintaining a nearly constant volume according to the pressure applied from the aforementioned flange (108). For example, this may be a cylindrical or disk-shaped flexible unit (10) which consists of silicone rubber. <IMAGE>
IPC 1-7
IPC 8 full level
B29C 45/26 (2006.01); B29C 45/02 (2006.01); B29C 45/58 (2006.01); H01L 21/56 (2006.01); B29L 31/34 (2006.01)
CPC (source: EP)
B29C 45/586 (2013.01); B29C 45/02 (2013.01)
Citation (search report)
- [A] US 4708613 A 19871124 - SERA MICHITOSHI [JP], et al
- [X] PATENT ABSTRACTS OF JAPAN vol. 015, no. 250 (E - 1082) 26 June 1991 (1991-06-26)
- [A] PATENT ABSTRACTS OF JAPAN vol. 009, no. 191 (M - 402) 7 August 1985 (1985-08-07)
- [A] PATENT ABSTRACTS OF JAPAN vol. 007, no. 199 (M - 240) 3 September 1983 (1983-09-03)
Designated contracting state (EPC)
DE FR GB IT NL
DOCDB simple family (publication)
DOCDB simple family (application)
EP 95104374 A 19950324; JP 7983694 A 19940325