Global Patent Index - EP 0683923 A4

EP 0683923 A4 19961204 - METHOD OF PRODUCING A RADIO FREQUENCY TRANSPONDER WITH A MOLDED ENVIRONMENTALLY SEALED PACKAGE.

Title (en)

METHOD OF PRODUCING A RADIO FREQUENCY TRANSPONDER WITH A MOLDED ENVIRONMENTALLY SEALED PACKAGE.

Title (de)

HERSTELLUNGSVERFAHREN EINES RADIOFREQUENZ-TRANSPONDERS MIT EINER GEGOSSENEN UMWELTVERSIEGELTEN PACKUNG.

Title (fr)

PROCEDE DE PRODUCTION D'UN REPETEUR DE FREQUENCES RADIOELECTRIQUES A BOITIER MOULE ETANCHE A L'ENVIRONNEMENT.

Publication

EP 0683923 A4 19961204 (EN)

Application

EP 94911417 A 19940214

Priority

  • US 1520093 A 19930211
  • US 15892293 A 19930611
  • US 9402074 W 19940214

Abstract (en)

[origin: WO9418700A1] A method of forming an environmentally sealed transponder type circuit wherein the circuit components are mounted on a lead frame type substrate (10; 31; 31'), the components are encapsulated in a plastic housing (28; 48) in a plastic molding process so that the housing is supported in the frame only by a plurality of the leads (39, 40; 39', 40'; 39', 40', 51, 52), and then severing the leads at the periphery of the housing (28; 48) to provide a leadless package. The frame may be formed of a conductive material (10), an insulating material or as a printed circuit board (30; 50). A printed circuit type lead frame (31') whereby a coil (44) of the circuit may be mechanically attached and directly secured to the frame is additionally disclosed.

IPC 1-7

H01L 23/02

IPC 8 full level

H04B 1/59 (2006.01); G01R 15/14 (2006.01); G06K 19/077 (2006.01); H01L 23/495 (2006.01); H01L 23/64 (2006.01); H01L 23/66 (2006.01)

CPC (source: EP US)

G01R 15/14 (2013.01 - EP US); G06K 19/047 (2013.01 - EP US); G06K 19/07724 (2013.01 - EP US); G06K 19/07749 (2013.01 - EP US); G06K 19/07758 (2013.01 - EP US); G06K 19/07779 (2013.01 - EP US); H01L 23/49562 (2013.01 - EP US); H01L 23/642 (2013.01 - EP US); H01L 23/645 (2013.01 - EP US); H01L 23/66 (2013.01 - EP US); H01L 24/97 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 24/49 (2013.01 - EP US); H01L 2224/05553 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2224/49171 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01019 (2013.01 - EP US); H01L 2924/01057 (2013.01 - EP US); H01L 2924/07802 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); H01L 2924/19041 (2013.01 - EP US); Y10T 29/49121 (2015.01 - EP US)

C-Set (source: EP US)

  1. H01L 2224/48091 + H01L 2924/00014
  2. H01L 2224/49171 + H01L 2224/48247 + H01L 2924/00
  3. H01L 2924/07802 + H01L 2924/00
  4. H01L 2924/00014 + H01L 2224/45099
  5. H01L 2924/181 + H01L 2924/00

Citation (search report)

Citation (examination)

Designated contracting state (EPC)

AT BE CH DE DK ES FR GB GR IE IT LI NL PT SE

DOCDB simple family (publication)

WO 9418700 A1 19940818; AU 6394394 A 19940829; AU 673423 B2 19961107; CA 2155208 A1 19940818; EP 0683923 A1 19951129; EP 0683923 A4 19961204; JP 3576166 B2 20041013; JP H08506708 A 19960716; US 5420757 A 19950530

DOCDB simple family (application)

US 9402074 W 19940214; AU 6394394 A 19940214; CA 2155208 A 19940214; EP 94911417 A 19940214; JP 51840094 A 19940214; US 15892293 A 19930611