EP 0685109 B1 19970813 - MICROMECHANICAL RELAY WITH HYBRID ACTUATOR
Title (en)
MICROMECHANICAL RELAY WITH HYBRID ACTUATOR
Title (de)
MIKROMECHANISCHES RELAIS MIT HYBRIDANTRIEB
Title (fr)
RELAIS MICROMECANIQUE A ACTIONNEMENT HYBRIDE
Publication
Application
Priority
- DE 9400152 W 19940214
- DE 4305033 A 19930218
Abstract (en)
[origin: US5666258A] PCT No. PCT/DE94/00152 Sec. 371 Date Aug. 17, 1995 Sec. 102(e) Date Aug. 17, 1995 PCT Filed Feb. 14, 1994 PCT Pub. No. WO94/19819 PCT Pub. Date Aug. 1, 1994A micromechanical relay is provided having a cantilevered armature (53) which is etched out from an armature substrate (52). The armature is in the form of a tongue, is elastically connected to the armature substrate, and forms an electrostatic drive with a base electrode (58) of a base substrate (51) located underneath. In addition, a piezo-layer (60) is provided on the armature (53). The piezo-layer (60) acts as a bending transducer and forms a supplemental actuator for a quick response time. When a voltage is applied to the electrodes of the armature (53), base substrate (51) and piezo-layer (60), the armature is attracted toward the base substrate and then rests over a large area on the base, closing at least one contact (55, 56). The different characteristics of the electrostatic actuator, on the one hand, and of the piezo-drive, on the other hand, are complementarily combined to provide a strong attraction force at the start of the armature movement, and a strong contact force is produced after the armature has been attracted.
IPC 1-7
IPC 8 full level
H01H 57/00 (2006.01); H01H 59/00 (2006.01); H01H 1/20 (2006.01); H01H 1/50 (2006.01)
CPC (source: EP US)
H01H 57/00 (2013.01 - EP US); H01H 59/0009 (2013.01 - EP US); H01H 1/20 (2013.01 - EP US); H01H 1/50 (2013.01 - EP US); H01H 2001/0057 (2013.01 - EP US); H01H 2001/0084 (2013.01 - EP US); H01H 2057/006 (2013.01 - EP US); H01H 2059/0081 (2013.01 - EP US)
Designated contracting state (EPC)
AT CH DE FR GB IT LI
DOCDB simple family (publication)
US 5666258 A 19970909; AT E156934 T1 19970815; CA 2156257 A1 19940901; CN 1040049 C 19980930; CN 1118199 A 19960306; DE 59403733 D1 19970918; EP 0685109 A1 19951206; EP 0685109 B1 19970813; JP H08506690 A 19960716; WO 9419819 A1 19940901
DOCDB simple family (application)
US 50531295 A 19950817; AT 94906870 T 19940214; CA 2156257 A 19940214; CN 94191220 A 19940214; DE 59403733 T 19940214; DE 9400152 W 19940214; EP 94906870 A 19940214; JP 51854394 A 19940214