EP 0688879 A1 19951227 - High vacuum apparatus member and vacuum apparatus
Title (en)
High vacuum apparatus member and vacuum apparatus
Title (de)
Hochvakuumanlage
Title (fr)
Appareil à vide élevée
Publication
Application
Priority
JP 16059694 A 19940620
Abstract (en)
A material suitable for vacuum apparatuses which is easily dehydrogenated by baking. The material has a composition of high-purity oxygen-free copper with a purity of 99.99 wt% or greater, which contains prior to baking 1 to 15 ppm of Zr and 3 ppm or less of oxygen. <IMAGE>
IPC 1-7
IPC 8 full level
C22C 9/00 (2006.01)
CPC (source: EP)
C22C 9/00 (2013.01)
Citation (search report)
- [X] US 5077005 A 19911231 - KATO MASANORI [JP]
- [X] US 4717436 A 19880105 - HOSODA NAOYUKI [JP], et al
- [X] EP 0296596 A1 19881228 - FURUKAWA ELECTRIC CO LTD [JP], et al
- [X] PATENT ABSTRACTS OF JAPAN vol. 13, no. 156 (C - 585) 14 April 1989 (1989-04-14)
- [X] PATENT ABSTRACTS OF JAPAN vol. 12, no. 122 (C - 488) 15 April 1988 (1988-04-15)
- [Y] RAJAINMAKI,H., KOLEHMAINEN,M.,HELENIUS,A.: "The Production and Application of Oxygen-Free Copper", JOURNAL OF METALS, vol. 45, no. 3, pages 68 - 70
- [Y] HELENIUS,A.,KOLEHMAINEN,M., RAJAINMAKI,H.: "Current and Future Uses of Oxygen-Free Copper", METALL, vol. 44, no. 11, pages 1067 - 1070
- [A] PATENT ABSTRACTS OF JAPAN vol. 12, no. 70 (C - 479) 4 March 1988 (1988-03-04)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0688879 A1 19951227; EP 0688879 B1 19980204; DE 69501569 D1 19980312; DE 69501569 T2 19980610; JP H083664 A 19960109
DOCDB simple family (application)
EP 95107446 A 19950517; DE 69501569 T 19950517; JP 16059694 A 19940620