EP 0690934 B1 19980617 - PROCESS AND DEVICE FOR ELECTROLYTIC PRECIPITATION OF METALLIC LAYERS
Title (en)
PROCESS AND DEVICE FOR ELECTROLYTIC PRECIPITATION OF METALLIC LAYERS
Title (de)
VERFAHREN UND VORRICHTUNG ZUR ELEKTROLYTISCHEN ABSCHEIDUNG VON METALLSCHICHTEN
Title (fr)
PROCEDE ET DISPOSITIF DE PRECIPITATION PAR ELECTROLYSE DE COUCHES METALLIQUES
Publication
Application
Priority
- DE 9401542 W 19941223
- DE 4344387 A 19931224
Abstract (en)
[origin: US5976341A] PCT No. PCT/DE94/01542 Sec. 371 Date Apr. 22, 1996 Sec. 102(e) Date Apr. 22, 1996 PCT Filed Dec. 23, 1994 PCT Pub. No. WO95/18251 PCT Pub. Date Jul. 6, 1995A process and apparatus for electrolytically depositing a uniform metal layer onto a workpiece is provided. The workpiece, for example a circuit board, serves as a cathode. The anode is insoluble and dimensionally stable. Both anode and cathode are immersed in a plating solution contained in an electrolytic container. The solution includes (a) ions of the metal to be deposited on the workpiece, (b) an additive substance for controlling physical-mechanical properties of the metal to be deposited, such as brightness, and (c) an electro-chemically reversible redox couple forming oxidizing compounds when contacting the anode. A metal-ion generator is provided, supplying metal parts of the metal to be deposited onto the workpiece; The plating solution is circulated between the container and the ion generator for maintaining a reaction between the oxidizing compounds and the metal parts for forming metal ions. The plating solution is controllably re-circulated into the container so that a low concentration of the oxidizing compounds is present in the plating solution adjacent to the workpiece.
IPC 1-7
IPC 8 full level
C25D 3/38 (2006.01); C25D 21/14 (2006.01)
CPC (source: EP US)
C25D 21/14 (2013.01 - EP US); Y10S 205/92 (2013.01 - EP US)
Designated contracting state (EPC)
AT CH DE ES FR GB IT LI NL SE
DOCDB simple family (publication)
US 5976341 A 19991102; AT E167532 T1 19980715; CA 2156407 A1 19950706; CA 2156407 C 20030902; DE 4344387 A1 19950629; DE 4344387 C2 19960905; DE 59406281 D1 19980723; EP 0690934 A1 19960110; EP 0690934 B1 19980617; ES 2118549 T3 19980916; JP 3436936 B2 20030818; JP H08507106 A 19960730; SG 52609 A1 19980928; TW 418263 B 20010111; WO 9518251 A1 19950706
DOCDB simple family (application)
US 50749996 A 19960422; AT 95904386 T 19941223; CA 2156407 A 19941223; DE 4344387 A 19931224; DE 59406281 T 19941223; DE 9401542 W 19941223; EP 95904386 A 19941223; ES 95904386 T 19941223; JP 51772495 A 19941223; SG 1996006707 A 19941223; TW 84106215 A 19950616