EP 0691166 A1 19960110 - Process and apparatus for pressure die-casting
Title (en)
Process and apparatus for pressure die-casting
Title (de)
Verfahren und Vorrichtung zum Druckgiessen
Title (fr)
Procédé et dispositif de moulage par injection
Publication
Application
Priority
IT MI941387 A 19940704
Abstract (en)
A process and an apparatus for the die-casting of pressure-cast metal parts according to which a metered quantity of the molten metal in a furnace (20) is fed, under pressure, into the cavity (75 - Fig. 8) of a die assembly (70, 76, 80 - Fig. 8) by means of an injection device (19) operated under controlled pressure and speed conditions; the molten metal is supplied at a pressure ranging between 50 and 350 Atm (4,9 - 34,3 MPa), and under laminar flow conditions by means of a thermally controlled injection device comprising zones thermally regulated at different temperatures for maintaining a condition of axial alignment between the chamber (21) and the plunger (22) of the injection device (19). <MATH>
IPC 1-7
IPC 8 full level
B22D 17/20 (2006.01); B22D 17/30 (2006.01); B22D 17/32 (2006.01)
CPC (source: EP)
B22D 17/2038 (2013.01); B22D 17/30 (2013.01); B22D 17/32 (2013.01)
Citation (applicant)
- US 4850420 A 19890725 - KOYA HIROKUNI [JP]
- US 4583579 A 19860422 - MIKI ISAO [JP], et al
- DE 3636936 A1 19880505 - BUEHLER AG GEB [CH]
- DE 3013226 A1 19811015 - NIPPON LIGHT METAL CO [JP]
- DE 3505554 A1 19860821 - HAHN ORTWIN, et al
- GB 489944 A 19380803 - JOSEF POLAK
- DE 1156205 B 19631024 - ECKERT G M B H GEB
- JP H01178359 A 19890714 - TOYOTA MOTOR CORP
Citation (search report)
- [DA] US 4850420 A 19890725 - KOYA HIROKUNI [JP]
- [A] DE 3427475 A1 19850214 - NIPPON LIGHT METAL CO [JP]
- [A] DE 3636936 A1 19880505 - BUEHLER AG GEB [CH]
- [A] DE 1156205 B 19631024 - ECKERT G M B H GEB
- [A] DE 3505554 A1 19860821 - HAHN ORTWIN, et al
- [A] GB 489944 A 19380803 - JOSEF POLAK
- [A] FR 902392 A 19450829 - MAHLE WERK GMBH
- [A] DE 3013226 A1 19811015 - NIPPON LIGHT METAL CO [JP]
- [A] PATENT ABSTRACTS OF JAPAN vol. 13, no. 458 (M - 880) 17 October 1989 (1989-10-17)
- [A] PATENT ABSTRACTS OF JAPAN vol. 009, no. 087 (M - 372) 17 April 1985 (1985-04-17)
- [A] PATENT ABSTRACTS OF JAPAN vol. 009, no. 235 (M - 415) 21 September 1985 (1985-09-21)
Designated contracting state (EPC)
CH DE FR GB IT LI SE
DOCDB simple family (publication)
EP 0691166 A1 19960110; CA 2152758 A1 19960105; CN 1127174 A 19960724; IT 1270059 B 19970428; IT MI941387 A0 19940704; IT MI941387 A1 19960104; TW 267958 B 19960111
DOCDB simple family (application)
EP 95110065 A 19950628; CA 2152758 A 19950627; CN 95115001 A 19950704; IT MI941387 A 19940704; TW 84106566 A 19950627