Global Patent Index - EP 0691705 B1

EP 0691705 B1 20020925 - Method for making a moisture sealed connection between an electrical lead an a thermistor of a temperature sensor

Title (en)

Method for making a moisture sealed connection between an electrical lead an a thermistor of a temperature sensor

Title (de)

Verfahren zur Herstellung einer feuchtigkeitsdichten Verbindung einer elektrischen Leitung mit einem Thermistor eines Temperatursensors

Title (fr)

Procédé de fabrication d'une connexion imperméable entre un conducteur électrique et une thermistance de capteur de temperature

Publication

EP 0691705 B1 20020925 (DE)

Application

EP 95110297 A 19950630

Priority

DE 4423985 A 19940707

Abstract (en)

[origin: EP0691705A1] The method manufactures a moisture tight connection between a cable (1) and a thermistor (4) of a temperature sensor. First of all thermistor contacts are electrically and mechanically connected to the cores (2, 3) of the cable. The cable end and the thermistor arranged at the cable end are injection moulded around by synthetic material which adheres tightly to the cable sleeve. In one embodiment the synthetic material is a thermoplast. The injection moulding is carried out in a multi-stage injection process. <IMAGE>

IPC 1-7

H01R 4/22

IPC 8 full level

B29C 45/14 (2006.01); H01C 7/04 (2006.01); H01R 4/22 (2006.01); H01R 43/24 (2006.01); H01R 13/66 (2006.01)

CPC (source: EP)

H01R 4/22 (2013.01); H01R 43/24 (2013.01); H01R 13/6683 (2013.01)

Designated contracting state (EPC)

AT DE FR GB IT SE

DOCDB simple family (publication)

EP 0691705 A1 19960110; EP 0691705 B1 20020925; AT E225087 T1 20021015; DE 4423985 A1 19960111; DE 4423985 C2 20020404; DE 59510387 D1 20021031; JP 2815555 B2 19981027; JP H0869904 A 19960312; TW 387640 U 20000411

DOCDB simple family (application)

EP 95110297 A 19950630; AT 95110297 T 19950630; DE 4423985 A 19940707; DE 59510387 T 19950630; JP 18821695 A 19950630; TW 86208730 U 19950531