EP 0696409 A1 19960214 - PROCESS FOR PRODUCING PRINTED CIRCUIT BOARDS
Title (en)
PROCESS FOR PRODUCING PRINTED CIRCUIT BOARDS
Title (de)
VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE
Title (fr)
PROCEDE DE FABRICATION D'UNE CARTE DE CIRCUITS IMPRIMES
Publication
Application
Priority
EP 9301004 W 19930426
Abstract (en)
[origin: WO9426081A1] A process is disclosed for producing a printed circuit board with a first and a second face. A plurality of connections (pads) for soldering electronic components and a plurality of tracks which interconnect the pads are applied on at least the first surface. A layer of solder (6) is applied on the pads by means of a first photoresist layer (3); the tracks are structured thereon by etchants by means of a second photoresist layer (7) which remains on the tracks and on the layer of solder (6) applied on the connections (10) of the pads (4). A solder resist (8) may then be applied on the printed circuit board outside of the pads (4). A process is also disclosed for manufacturing a mask suitable for implementing this printed circuit board production process. According to said process, said masks are produced in a simple manner from known base masks.
IPC 1-7
H05K 3/24; H05K 3/06; H05K 3/34; H05K 3/40; H05K 3/42; H05K 3/00
IPC 8 full level
H05K 3/00 (2006.01); H05K 3/24 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); H05K 3/06 (2006.01)
CPC (source: EP)
H05K 3/0002 (2013.01); H05K 3/243 (2013.01); H05K 3/28 (2013.01); H05K 3/3473 (2013.01); H05K 3/427 (2013.01); H05K 3/064 (2013.01); H05K 2201/099 (2013.01); H05K 2203/043 (2013.01); H05K 2203/056 (2013.01); H05K 2203/0571 (2013.01); H05K 2203/0588 (2013.01)
Citation (search report)
See references of WO 9426081A1
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
WO 9426081 A1 19941110; EP 0696409 A1 19960214; TW 234234 B 19941111
DOCDB simple family (application)
EP 9301004 W 19930426; EP 93909840 A 19930426; TW 82103943 A 19930519