EP 0698676 B1 19970924 - Bath for electroplating copper-tin alloys
Title (en)
Bath for electroplating copper-tin alloys
Title (de)
Bad zum galvanischen Abscheiden von Kupfer-Zinn-Legierungen
Title (fr)
Bain d'électrodéposition d'alliages cuivre-étain
Publication
Application
Priority
DE 4426914 A 19940729
Abstract (en)
[origin: DE4426914C1] Bath for galvanically depositing Cu-Sn alloys, consisting of H2O, Cu-cyanide, Sn (IV) cpd, alkali metal-cyanide, -hydroxide and complex former and additionally contg. alkali metal phosphate, contains the K-salt of gluconic acid, gluconic acid and/or glucuronic acid as complex former and has a pH of 8-14.
IPC 1-7
IPC 8 full level
C25D 3/32 (2006.01); C25D 3/40 (2006.01); C25D 3/58 (2006.01); C25D 3/60 (2006.01)
CPC (source: EP)
Designated contracting state (EPC)
CH DE FR GB IT LI
DOCDB simple family (publication)
DE 4426914 C1 19950817; DE 59500711 D1 19971030; EP 0698676 A1 19960228; EP 0698676 B1 19970924
DOCDB simple family (application)
DE 4426914 A 19940729; DE 59500711 T 19950324; EP 95104355 A 19950324