Global Patent Index - EP 0702094 B1

EP 0702094 B1 19991027 - Use of a hardenable copper alloy

Title (en)

Use of a hardenable copper alloy

Title (de)

Verwendung einer aushärtbaren Kupferlegierung

Title (fr)

Utilisation d'un alliage de cuivre durcissable

Publication

EP 0702094 B1 19991027 (DE)

Application

EP 95110134 A 19950629

Priority

DE 4427939 A 19940806

Abstract (en)

[origin: US6565681B1] A method for manufacturing casting molds, in particular continuous casting molds which are used with an electromagnetic rabbling mechanism in the continuous casting of steel, is provided. The method comprises selecting a specified age-hardenable copper alloy to have a Ni content from 0.1 to 2.0% which allows the electrical conductivity of the copper alloy to be adjusted from 80 to 35 IACS. The method further comprises melting, casting, hot-rolling, solution heat treating and rapidly cooling the copper alloy, followed by age-hardening, wherein the mold has a tensile strength of at least 430 N/mm2, is highly thermally conductive and exhibits low magnetic field damping. A method of using an age-hardenable copper alloy is also provided.

IPC 1-7

C22C 9/06; B22D 11/04

IPC 8 full level

C22C 1/02 (2006.01); B22D 11/04 (2006.01); B22D 11/059 (2006.01); C22C 9/00 (2006.01); C22C 9/04 (2006.01); C22C 9/06 (2006.01)

CPC (source: EP KR US)

B22D 11/059 (2013.01 - EP US); B22D 11/12 (2013.01 - KR); C22C 9/01 (2013.01 - KR); C22C 9/06 (2013.01 - EP KR US)

Designated contracting state (EPC)

AT BE CH DE ES FR GB IT LI PT SE

DOCDB simple family (publication)

US 6565681 B1 20030520; AT E186076 T1 19991115; CN 1058532 C 20001115; CN 1122837 A 19960522; DE 4427939 A1 19960208; DE 59507131 D1 19991202; EP 0702094 A1 19960320; EP 0702094 B1 19991027; ES 2139780 T3 20000216; FI 112669 B 20031231; FI 953730 A0 19950804; FI 953730 A 19960207; JP H08104928 A 19960423; KR 100374051 B1 20030509; KR 960007802 A 19960322; PL 177973 B1 20000229; PL 309841 A1 19960219; RU 2160648 C2 20001220; ZA 956181 B 19960308

DOCDB simple family (application)

US 90182097 A 19970728; AT 95110134 T 19950629; CN 95108676 A 19950803; DE 4427939 A 19940806; DE 59507131 T 19950629; EP 95110134 A 19950629; ES 95110134 T 19950629; FI 953730 A 19950804; JP 20004595 A 19950804; KR 19950019576 A 19950705; PL 30984195 A 19950731; RU 95113726 A 19950724; ZA 956181 A 19950725