Global Patent Index - EP 0702618 A4

EP 0702618 A4 19960417 -

Publication

EP 0702618 A4 19960417

Application

EP 94920126 A 19940609

Priority

  • US 9406499 W 19940609
  • US 7568393 A 19930611
  • US 25153194 A 19940606

Abstract (en)

[origin: WO9429092A1] A method of heat treating ceramic-based electronic components (20a, 20b) by providing a furnace fixture (14) adapted to support the ceramic-based electronic components (20a, 20b) which is made from a substrate selected from the group consisting of silicon carbide, cordierite, mullite, stabilized zirconia, magnesium oxide and alumina containing a glassy bond phase. A cladding layer of zirconia or magnesia is then deposited on the furnace fixture substrate by plasma deposition. The ceramic-based electronic based components (20a, 20b) to be fired are placed on the zirconia-coated substrate (18); and heated to a desired temperature to heat treat the components (20a, 20b).

IPC 1-7

B28B 11/04

IPC 8 full level

C04B 35/64 (2006.01); C04B 35/111 (2006.01); C04B 35/622 (2006.01); C04B 41/00 (2006.01); C04B 41/50 (2006.01); C04B 41/80 (2006.01); C04B 41/87 (2006.01); F27D 3/12 (2006.01); H01C 17/00 (2006.01); H01G 4/12 (2006.01); H01L 23/08 (2006.01)

CPC (source: EP US)

C04B 35/111 (2013.01 - EP US); C04B 35/622 (2013.01 - EP US); C04B 41/0072 (2013.01 - EP US); C04B 41/009 (2013.01 - EP US); C04B 41/5029 (2013.01 - EP US); C04B 41/5042 (2013.01 - EP US); C04B 41/80 (2013.01 - EP US); C04B 41/87 (2013.01 - EP US)

Citation (search report)

  • [A] FR 2612511 A1 19880923 - SHINAGAWA REFRACTORIES CO [JP]
  • [A] DATABASE WPI Section Ch Week 8810, Derwent World Patents Index; Class LQ, AN 88-068984 (10)
  • [A] DATABASE WPI Section Ch Week 9239, Derwent World Patents Index; Class LQ, AN 92-319997 (39)
  • [A] DATABASE WPI Week 9044, Derwent World Patents Index; AN 90-331918 (44)
  • See references of WO 9429092A1

Designated contracting state (EPC)

AT DE FR GB NL

DOCDB simple family (publication)

WO 9429092 A1 19941222; AU 7103194 A 19950103; EP 0702618 A1 19960327; EP 0702618 A4 19960417; JP H08511613 A 19961203; US 5603875 A 19970218

DOCDB simple family (application)

US 9406499 W 19940609; AU 7103194 A 19940609; EP 94920126 A 19940609; JP 50209395 A 19940609; US 25153194 A 19940606