EP 0703951 B1 19980715 - ELECTRICALLY CONDUCTIVE ADHESIVE COMPOSITIONS
Title (en)
ELECTRICALLY CONDUCTIVE ADHESIVE COMPOSITIONS
Title (de)
Elektrisch leitfähige Klebstoff-Zusammensetzungen
Title (fr)
COMPOSITIONS D'ADHESIFS ELECTROCONDUCTEURS
Publication
Application
Priority
- US 9404828 W 19940502
- US 7874093 A 19930616
Abstract (en)
[origin: US5362421A] An anisotropically conductive adhesive composition provides electrical conductivity between facing electrodes but maintains electric insulation laterally between adjacent electrodes and comprises (a) a cationically polymerizable monomer, such as a glycidyl epoxy resin; (b) a thermoplastic resin, essentially free of nucleophilic or metal complexing functional groups; (c) optionally, an alcohol containing material; (d) a thermally initiated catalyst system comprising: (1) a salt of an organometallic cation; (2) a cure rate enhancer; and (3) a stabilizing additive; (e) conductive particles; and (f) optionally, a silane coupling agent, wherein the adhesive compositions cure at a temperature of 120 DEG -125 DEG C.
IPC 1-7
IPC 8 full level
C08G 59/40 (2006.01); C08F 2/50 (2006.01); C08G 59/68 (2006.01); C09J 9/02 (2006.01); C09J 163/00 (2006.01); C09J 201/00 (2006.01); H01B 1/22 (2006.01); H05K 3/32 (2006.01)
CPC (source: EP KR US)
C08G 59/68 (2013.01 - EP US); C09J 9/02 (2013.01 - KR); C09J 163/00 (2013.01 - EP US); H05K 3/323 (2013.01 - EP US); C08L 2666/02 (2013.01 - EP US); H05K 2201/0129 (2013.01 - EP US); H05K 2201/0239 (2013.01 - EP US); H05K 2203/121 (2013.01 - EP US); Y10T 428/2839 (2015.01 - EP US); Y10T 428/2852 (2015.01 - EP US)
C-Set (source: EP US)
Designated contracting state (EPC)
CH DE FR GB IT LI
DOCDB simple family (publication)
US 5362421 A 19941108; CA 2162882 A1 19941222; CA 2162882 C 20050726; CN 1056399 C 20000913; CN 1128040 A 19960731; DE 69411740 D1 19980820; DE 69411740 T2 19990408; EP 0703951 A1 19960403; EP 0703951 B1 19980715; JP 3652698 B2 20050525; JP H08511570 A 19961203; KR 100336188 B1 20021011; KR 960703159 A 19960619; SG 46676 A1 19980220; WO 9429397 A1 19941222
DOCDB simple family (application)
US 7874093 A 19930616; CA 2162882 A 19940502; CN 94192398 A 19940502; DE 69411740 T 19940502; EP 94915446 A 19940502; JP 50176795 A 19940502; KR 19950705686 A 19951214; SG 1996008092 A 19940502; US 9404828 W 19940502