EP 0704891 B1 19990623 - Quartz glass heat treatment apparatus for semiconductor wafers and method for producing same
Title (en)
Quartz glass heat treatment apparatus for semiconductor wafers and method for producing same
Title (de)
Vorrichtung aus Quarzglas zum Wärmebehandlung von Halbleiterscheibchen und Herstellungsverfahren dafür
Title (fr)
Appareil en verre de quartz pour le traitement thermique de plaquettes semi-conductrices et procédé de fabrication
Publication
Application
Priority
JP 25982994 A 19940930
Abstract (en)
[origin: EP0704891A1] A reaction tube 10 without occurrence of crack or breakdown or a wafer boat 20 without generation of particles is provided, such various faults being caused by the difference between the thermal expansion coefficients of a thin film and one of those quartz glass jigs. The present invention is applied to a quartz glass jig used in a thermal CVD apparatus, and is characterized in that the jig is made of transparent quartz glass material, and that the portion or portions exposed to the heat treatment space or the portions contacting with wafers 30 are sand-blasted. The reason why transparent quartz glass is limited as the material is that, in case of transparent quartz glass, the surface hardness is more uniform in comparison to bubble-mixed or opaque quartz glass and thus a predetermined surface roughness is more effectively achieved by sand-blasting, so that the faults as mentioned above due to the stress occurring in the treatment between a CVD film and one of the quartz glass jigs are effectively prevented. <IMAGE>
IPC 1-7
IPC 8 full level
C03B 20/00 (2006.01); H01L 21/205 (2006.01); H01L 21/22 (2006.01); H01L 21/673 (2006.01); H01L 21/68 (2006.01)
CPC (source: EP US)
H01L 21/67306 (2013.01 - EP US); H01L 21/68 (2013.01 - EP US); H01L 21/6835 (2013.01 - EP US)
Citation (examination)
- Japanese Industrial Standard, Definitions and Designation of Surface Roughness, JIS B 0601-1982, revised in February 1994, Section 3.1
- ANSI/ASME (American National Standard/American Society of Mechanical Engineers) B46.1-1985, "Surface Texture (Surface Roughness, Waviness, and Lay)", Section C3
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0704891 A1 19960403; EP 0704891 B1 19990623; DE 69510421 D1 19990729; DE 69510421 T2 20000316; JP 3473715 B2 20031208; JP H08102447 A 19960416; US 6425168 B1 20020730
DOCDB simple family (application)
EP 95306554 A 19950918; DE 69510421 T 19950918; JP 25982994 A 19940930; US 53102395 A 19950820