EP 0706890 A3 19980909 - Method and apparatus for the thermal embossing of a substrate
Title (en)
Method and apparatus for the thermal embossing of a substrate
Title (de)
Verfahren zur Behandlung von Zahlungen
Title (fr)
Méthode pour traiter des paiements
Publication
Application
Priority
DE 4433054 A 19940916
Abstract (en)
[origin: DE4433054C1] The hot imprinting process involves passing the substrate and imprinting foil with colour layer opposite each other through an imprinting unit with heater, printing head (16) and counter-pressure drum (12). For preheating, the substrate and foil are pushed onto the surface (20) of the counter-pressure drum. The printing head alternately prints one line in the circumferential direction over the drum surface concentric with it. Then the printing head is pushed forward to print another line across the circumferential direction and parallel to the drum surface.
IPC 1-7
IPC 8 full level
B41J 2/325 (2006.01); B41J 3/38 (2006.01); B41M 1/24 (2006.01); B44C 1/17 (2006.01)
CPC (source: EP)
B41J 2/325 (2013.01); B41J 3/38 (2013.01); B41M 1/24 (2013.01); B44C 1/1729 (2013.01)
Citation (search report)
- [DA] DE 2844698 A1 19790426 - TELECOMUNICACION ELECTRONICA Y
- [DA] EP 0179977 A2 19860507 - AVERY INTERNATIONAL CORP [US]
- [DA] EP 0369162 A2 19900523 - SIEMENS NIXDORF INF SYST [DE]
- [A] DE 9206302 U1 19920730
- [A] DE 3743676 A1 19890706 - HINTERKOPF GMBH [DE]
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
DE 4433054 C1 19960222; EP 0706890 A2 19960417; EP 0706890 A3 19980909
DOCDB simple family (application)
DE 4433054 A 19940916; EP 95202312 A 19950828