EP 0707663 A1 19960424 - SPUTTERING DEVICE
Title (en)
SPUTTERING DEVICE
Title (de)
Sputtervorrichtung
Title (fr)
DISPOSITIF DE PULVERISATION
Publication
Application
Priority
- US 9406908 W 19940617
- US 7876693 A 19930617
Abstract (en)
[origin: WO9500677A1] A sputter coating system (10) employing a vacuum chamber (1). A movable surface (2) is provided within the chamber which is adapted for mounting substrates (3) and moving them thereon. At least one magnetron sputtering device (5) is positioned at a work station adjacent to the substrate holder and adapted for sputtering at least a selected material onto the substrate. At least a second device (6) is positioned adjacent the first device for providing a plasma (11) for enhancing the plasma formed by the first device.
IPC 1-7
IPC 8 full level
C23C 14/34 (2006.01); C23C 14/00 (2006.01); C23C 14/35 (2006.01); C23C 14/56 (2006.01); H01J 37/34 (2006.01)
CPC (source: EP)
C23C 14/0047 (2013.01); C23C 14/0078 (2013.01); H01J 37/32192 (2013.01); H01J 37/3233 (2013.01); H01J 37/32678 (2013.01); H01J 37/32862 (2013.01); H01J 37/3405 (2013.01)
Designated contracting state (EPC)
AT BE CH DE DK ES FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 9500677 A1 19950105; EP 0707663 A1 19960424; EP 0707663 A4 19980114; JP H08511830 A 19961210
DOCDB simple family (application)
US 9406908 W 19940617; EP 94921324 A 19940617; JP 50299794 A 19940617