EP 0708327 A1 19960424 - Method and apparatus for thermal impedance evaluation of packaged semiconductor components
Title (en)
Method and apparatus for thermal impedance evaluation of packaged semiconductor components
Title (de)
Methode und Apparat zur Messung der thermischen Impedanz von integrierten Halbleiterkomponenten
Title (fr)
Méthode et appareil pour la mesure d'impedance thermique des components semi-conducteurs intégrées
Publication
Application
Priority
- BE 9400949 A 19941019
- BE 9500085 W 19950918
Abstract (en)
The present invention is related to a system for evaluating the thermal impedance of packaged semiconductor chips. The measuring apparatus according to the invention includes a thermostatic bath filled with a dielectric liquid and a temperature sensor for measuring the temperature of said bath. The semiconductor chip is subjected to a calibration step followed by a thermal response measurement step. Increasing the power pulse length allows measurement of the steady-state junction-to-case thermal resistance. The measuring apparatus and method is further used for tracing in-situ degradation of packaged semiconductor chips due to power cycling. <IMAGE>
IPC 1-7
IPC 8 full level
G01N 25/18 (2006.01)
CPC (source: EP US)
G01N 25/18 (2013.01 - EP US)
Citation (search report)
- [Y] GB 2107066 A 19830420 - INT HARVESTER CO [US]
- [A] EP 0228333 A2 19870708 - BULL SA [FR]
- [Y] PIERRE PARIS, JEAN-MARIE HAUSONNE ET JEAN LOSTEC: "Appareil permettant la caracterisation thermique de substrats et materiaux a forte coductibilite pour micro-electronique", JOURNAL DE LA PHYSIQUE, vol. 3, no. 4, PARIS, pages 677 - 688, XP000359614
Designated contracting state (EPC)
AT BE CH DE DK ES FR GB GR IE IT LI LU NL PT SE
DOCDB simple family (publication)
EP 0708327 A1 19960424; EP 0708327 B1 20030723; AT E245811 T1 20030815; BE 1008808 A3 19960806; DE 69531329 D1 20030828; DE 69531329 T2 20040422; JP 3872120 B2 20070124; JP H08254512 A 19961001; US 5795063 A 19980818; US 5927853 A 19990727
DOCDB simple family (application)
EP 95870116 A 19951019; AT 95870116 T 19951019; BE 9400949 A 19941019; DE 69531329 T 19951019; JP 27146495 A 19951019; US 54386795 A 19951019; US 75723896 A 19961127