EP 0708795 A4 19960807 - HEAT-RESISTANT POLYIMIDE BLENDS AND LAMINATES
Title (en)
HEAT-RESISTANT POLYIMIDE BLENDS AND LAMINATES
Title (de)
HITZEBESTÄNDIGE POLYMIDMISCHUNGEN UND LAMINATE
Title (fr)
MELANGES ET STRATIFIES DE POLYIMIDE THERMORESISTANTS
Publication
Application
Priority
- US 9404147 W 19940415
- US 9222693 A 19930715
- US 9222593 A 19930715
Abstract (en)
[origin: WO9502627A1] This invention relates to heat-resistant polyimide blends and molded parts thereof, which have excellent heat and moisture resistance, are relatively soluble in organic solvents, have excellent mechanical processibility, and are suited for laminating and molding. The blends contain a thermoplastic polyimide component and a thermosetting imide oligomer. The weight ratio of the thermoplastic component to thermosetting component is selected in the range of 99/1 to 5/95. The thermoplastic polyimide component has a number average molecular weight of 10,000 or more.
IPC 1-7
C08G 69/26; C08G 73/10; C08G 69/28; C08L 77/06; B05D 1/00; B05D 3/02
IPC 8 full level
B05D 7/00 (2006.01); C08G 73/10 (2006.01); C08J 3/09 (2006.01); C08J 5/24 (2006.01); C08L 79/08 (2006.01); D06N 3/12 (2006.01); D21H 19/30 (2006.01); H05K 1/03 (2006.01)
CPC (source: EP)
C08J 3/091 (2013.01); C08L 79/08 (2013.01); D06N 3/125 (2013.01); D21H 19/30 (2013.01); C08J 2379/08 (2013.01); H05K 1/0346 (2013.01)
Citation (search report)
- [X] PATENT ABSTRACTS OF JAPAN vol. 14, no. 531 (C - 780) 21 November 1990 (1990-11-21)
- See references of WO 9502627A1
Designated contracting state (EPC)
AT BE DE DK FR GB IT NL
DOCDB simple family (publication)
WO 9502627 A1 19950126; CA 2144324 A1 19950126; EP 0708795 A1 19960501; EP 0708795 A4 19960807; JP H10503221 A 19980324
DOCDB simple family (application)
US 9404147 W 19940415; CA 2144324 A 19940415; EP 94916533 A 19940415; JP 50452195 A 19940415