EP 0708982 A1 19960501 - A METHOD OF TREATING A SEMI-CONDUCTOR WAFER
Title (en)
A METHOD OF TREATING A SEMI-CONDUCTOR WAFER
Title (de)
BEHANDLUNGSVERFAHREN FÜR EINE HALBLEITENDE SCHEIBE
Title (fr)
PROCEDE DE TRAITEMENT POUR GALETTES SEMI-CONDUCTRICES
Publication
Application
Priority
- GB 9501057 W 19950510
- GB 9409713 A 19940514
Abstract (en)
[origin: WO9531823A1] A method of treating a semi-conductor wafer is described in which a short-chain polymer is deposited on the wafer to planarise surface features on the wafer and a diffusion layer is deposited on the surface of the polymer layer to allow moisture to be released from the polymer at a controlled rate.
IPC 1-7
IPC 8 full level
H01L 21/312 (2006.01); H01L 21/316 (2006.01)
CPC (source: EP KR)
H01L 21/02118 (2013.01 - KR); H01L 21/02126 (2013.01 - EP KR); H01L 21/02271 (2013.01 - EP); H01L 21/02274 (2013.01 - KR); H01L 21/02304 (2013.01 - EP KR); H01L 21/02315 (2013.01 - EP KR); H01L 21/02362 (2013.01 - EP KR); H01L 21/324 (2013.01 - KR)
Citation (search report)
See references of WO 9531823A1
Designated contracting state (EPC)
AT BE CH DE ES FR GB IE IT LI NL SE
DOCDB simple family (publication)
WO 9531823 A1 19951123; CA 2167085 A1 19951123; CN 1128582 A 19960807; EP 0708982 A1 19960501; GB 9409713 D0 19940706; JP H09501020 A 19970128; KR 100334855 B1 20021113; KR 960704349 A 19960831; TW 307020 B 19970601
DOCDB simple family (application)
GB 9501057 W 19950510; CA 2167085 A 19950510; CN 95190426 A 19950510; EP 95918082 A 19950510; GB 9409713 A 19940514; JP 52943695 A 19950510; KR 19960700128 A 19960111; TW 84106199 A 19950616