Global Patent Index - EP 0710178 A1

EP 0710178 A1 19960508 - CONFORMAL THERMALLY CONDUCTIVE INTERFACE MATERIAL

Title (en)

CONFORMAL THERMALLY CONDUCTIVE INTERFACE MATERIAL

Title (de)

GUT AN DER FORM ANLIEGENDES WÄRMELEITENDES INTERFACE-MATERIAL

Title (fr)

MATERIAU D'INTERFACE THERMOCONDUCTEUR CONFORMABLE

Publication

EP 0710178 A1 19960508 (EN)

Application

EP 94921502 A 19940711

Priority

  • US 9407793 W 19940711
  • US 9149793 A 19930714

Abstract (en)

[origin: WO9502505A1] A thermally conductive interface material formed of a polymeric binder (2), one or more thermally conductive fillers (1) and an expanded metal mesh layer (3) at least partially embedded into one of the major surfaces of the binder is disclosed. Preferably, the interface is a pressure sensitive adhesive material and more preferably, it is in the form of a tape or self-adhesive pads.

IPC 1-7

B32B 3/24; H05K 7/00; F28F 7/00

IPC 8 full level

B32B 3/24 (2006.01); C08K 3/00 (2006.01); C08L 101/00 (2006.01); C09J 133/04 (2006.01); C09J 133/06 (2006.01); C09J 175/00 (2006.01); C09J 175/04 (2006.01); C09J 183/00 (2006.01); C09J 183/04 (2006.01); F28F 13/00 (2006.01); H01L 23/373 (2006.01); H05K 7/20 (2006.01)

CPC (source: EP KR US)

B32B 3/10 (2013.01 - KR); B32B 3/266 (2013.01 - EP); B32B 5/18 (2013.01 - US); B32B 27/065 (2013.01 - US); B32B 27/20 (2013.01 - US); F28F 7/00 (2013.01 - KR); F28F 13/00 (2013.01 - EP); H01L 23/3733 (2013.01 - EP); H05K 7/00 (2013.01 - KR); H05K 7/20472 (2013.01 - EP); B32B 2266/045 (2013.01 - US); B32B 2307/302 (2013.01 - US); H01L 2924/0002 (2013.01 - EP)

Designated contracting state (EPC)

DE ES FR GB IE IT SE

DOCDB simple family (publication)

WO 9502505 A1 19950126; EP 0710178 A1 19960508; EP 0710178 A4 19970611; JP H09501016 A 19970128; KR 960703723 A 19960831; TW 257887 B 19950921

DOCDB simple family (application)

US 9407793 W 19940711; EP 94921502 A 19940711; JP 50465995 A 19940711; KR 19960700166 A 19960113; TW 83107108 A 19940803