EP 0710178 A4 19970611 - CONFORMAL THERMALLY CONDUCTIVE INTERFACE MATERIAL
Title (en)
CONFORMAL THERMALLY CONDUCTIVE INTERFACE MATERIAL
Title (de)
GUT AN DER FORM ANLIEGENDES WÄRMELEITENDES INTERFACE-MATERIAL
Title (fr)
MATERIAU D'INTERFACE THERMOCONDUCTEUR CONFORMABLE
Publication
Application
Priority
- US 9407793 W 19940711
- US 9149793 A 19930714
Abstract (en)
[origin: WO9502505A1] A thermally conductive interface material formed of a polymeric binder (2), one or more thermally conductive fillers (1) and an expanded metal mesh layer (3) at least partially embedded into one of the major surfaces of the binder is disclosed. Preferably, the interface is a pressure sensitive adhesive material and more preferably, it is in the form of a tape or self-adhesive pads.
IPC 1-7
IPC 8 full level
B32B 3/24 (2006.01); C08K 3/00 (2006.01); C08L 101/00 (2006.01); C09J 133/04 (2006.01); C09J 133/06 (2006.01); C09J 175/00 (2006.01); C09J 175/04 (2006.01); C09J 183/00 (2006.01); C09J 183/04 (2006.01); F28F 13/00 (2006.01); H01L 23/373 (2006.01); H05K 7/20 (2006.01)
CPC (source: EP KR US)
B32B 3/10 (2013.01 - KR); B32B 3/266 (2013.01 - EP); B32B 5/18 (2013.01 - US); B32B 27/065 (2013.01 - US); B32B 27/20 (2013.01 - US); F28F 7/00 (2013.01 - KR); F28F 13/00 (2013.01 - EP); H01L 23/3733 (2013.01 - EP); H05K 7/00 (2013.01 - KR); H05K 7/20472 (2013.01 - EP); B32B 2266/045 (2013.01 - US); B32B 2307/302 (2013.01 - US); H01L 2924/0002 (2013.01 - EP)
Citation (search report)
- [DX] US 5213868 A 19930525 - LIBERTY JAMES [US], et al
- [X] EP 0528606 A2 19930224 - CHOMERICS INC [US]
- [A] US 4258100 A 19810324 - FUJITANI TAKEO, et al
- [A] US 4037009 A 19770719 - SEVERINSEN JOHN
- [A] US 4685987 A 19870811 - FICK HERBERT J [US]
- [A] PATENT ABSTRACTS OF JAPAN vol. 013, no. 445 (E - 829) 6 October 1989 (1989-10-06)
- See references of WO 9502505A1
Designated contracting state (EPC)
DE ES FR GB IE IT SE
DOCDB simple family (publication)
WO 9502505 A1 19950126; EP 0710178 A1 19960508; EP 0710178 A4 19970611; JP H09501016 A 19970128; KR 960703723 A 19960831; TW 257887 B 19950921
DOCDB simple family (application)
US 9407793 W 19940711; EP 94921502 A 19940711; JP 50465995 A 19940711; KR 19960700166 A 19960113; TW 83107108 A 19940803