Global Patent Index - EP 0710522 A1

EP 0710522 A1 19960508 - Flux formulation

Title (en)

Flux formulation

Title (de)

Flussmittelzusammensetzung

Title (fr)

Composition de flux

Publication

EP 0710522 A1 19960508 (EN)

Application

EP 95306518 A 19950915

Priority

US 32794194 A 19941024

Abstract (en)

A novel flux formulation for the assembly of electronic circuit boards having a conformal coating comprises: (1) a solvent, pref. water; (2) a water-soluble weak organic acid, pref. adipic acid; (3) a halide-free non-ionic surfactant, pref. an alcohol ethoxylate; and (4) a biocidal co-solvent, pref. isopropanol. The formulation is compatible with the cpd. coating, allows the elimination of post-soldering cleaning and emits no volatile organic cpds. during fluxing and soldering. Also claimed is a method for soldering which comprises: (i) heating the components to be soldered to a suitable temp.; and (ii) applying to the surface to be soldered, solder and the disclosed flux.

IPC 1-7

B23K 35/363

IPC 8 full level

B23K 35/36 (2006.01); B23K 35/363 (2006.01)

CPC (source: EP US)

B23K 35/3612 (2013.01 - EP US); B23K 35/3618 (2013.01 - EP US)

Citation (applicant)

Citation (search report)

Designated contracting state (EPC)

DE GB PT

DOCDB simple family (publication)

US 5443660 A 19950822; CA 2161154 A1 19960425; DE 69519148 D1 20001123; DE 69519148 T2 20010510; EP 0710522 A1 19960508; EP 0710522 B1 20001018; PT 710522 E 20010430

DOCDB simple family (application)

US 32794194 A 19941024; CA 2161154 A 19951023; DE 69519148 T 19950915; EP 95306518 A 19950915; PT 95306518 T 19950915