EP 0714721 A2 19960605 - Applying flux to a solder wave for wave soldering an element
Title (en)
Applying flux to a solder wave for wave soldering an element
Title (de)
Aufbringen eines Lötflussmittels auf eine Lötwelle zum Wellenlöten eines Elementes
Title (fr)
Application d'un fondant de soudage sur la vague de soudage pour souder à la vague un élément
Publication
Application
Priority
US 34760694 A 19941130
Abstract (en)
A process for applying flux in solid, liquid or gaseous form directly to a solder wave (26) avoids prefluxing of printed circuit boards or other elements (44) to be soldered or solder wetted. The process comprises the steps of forming a solder wave (26) above a solder reservoir (16), applying a flux directly to the solder wave separately from a shield gas delivery means (36) to blanket the solder wave, and conveying the element (44) through at least a portion of the solder wave. The process is applicable to wave soldering under a shroud (32) wherein a shield gas is supplied by diffusers (36) under the shroud, the flux being applied by at least one gas applicator (54) directly to the solder wave. <IMAGE>
IPC 1-7
IPC 8 full level
CPC (source: EP US)
B23K 1/085 (2013.01 - EP US); B23K 1/203 (2013.01 - EP US); B23K 2101/42 (2018.07 - EP US)
Citation (applicant)
- US 5044542 A 19910903 - DEAMBROSIO CARLOS A [CA]
- US 5121874 A 19920616 - DEAMBROSIO CARLOS A [CA], et al
- US 5048746 A 19910917 - ELLIOTT DONALD A [CA], et al
- US 5090651 A 19920225 - MITTAG MICHAEL T [US]
- US 5203489 A 19930420 - GILETA JOHN H [US], et al
- US 5292055 A 19940308 - GILETA JOHN H [CA]
- US 5240169 A 19930831 - GILETA JOHN H [CA]
Designated contracting state (EPC)
CH DE FR GB IT LI NL
DOCDB simple family (publication)
EP 0714721 A2 19960605; EP 0714721 A3 19960612; CA 2158821 A1 19960531; US 5568894 A 19961029
DOCDB simple family (application)
EP 95308051 A 19951110; CA 2158821 A 19950921; US 34760694 A 19941130