EP 0720234 A2 19960703 - Vertical power MOSFET having thick metal layer to reduce distributed resistance and method of fabricating the same
Title (en)
Vertical power MOSFET having thick metal layer to reduce distributed resistance and method of fabricating the same
Title (de)
Vertikaler Leistungs-MOSFET mit dicker Metallschicht zur Verminderung des verteilten Widerstandes und Verfahren zur Herstellung
Title (fr)
MOSFET de puissance vertical ayant une couche de métal épais pour réduire la résistance distribuée et méthode de fabrication
Publication
Application
Priority
US 36748694 A 19941230
Abstract (en)
The on-resistance of a vertical power transistor is substantially reduced by forming a thick metal layer on top of the relatively thin metal layer that is conventionally used to make contact with the individual transistor cells in the device. The thick metal layer is preferably plated electrolessly on the thin metal layer through an opening that is formed in the passivation layer. <IMAGE>
IPC 1-7
IPC 8 full level
H01L 21/336 (2006.01); H01L 21/60 (2006.01); H01L 23/482 (2006.01); H01L 23/485 (2006.01); H01L 27/04 (2006.01); H01L 29/417 (2006.01); H01L 29/78 (2006.01)
CPC (source: EP US)
H01L 23/4824 (2013.01 - EP US); H01L 24/03 (2013.01 - EP US); H01L 24/05 (2013.01 - EP US); H01L 24/06 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 24/49 (2013.01 - EP US); H01L 29/41741 (2013.01 - EP US); H01L 29/73 (2013.01 - EP US); H01L 29/7395 (2013.01 - EP US); H01L 29/7802 (2013.01 - EP US); H01L 29/7811 (2013.01 - EP US); H01L 29/7813 (2013.01 - EP US); H01L 24/45 (2013.01 - EP US); H01L 2224/04042 (2013.01 - EP US); H01L 2224/05082 (2013.01 - EP US); H01L 2224/05083 (2013.01 - EP US); H01L 2224/05118 (2013.01 - EP US); H01L 2224/05124 (2013.01 - EP US); H01L 2224/05155 (2013.01 - EP US); H01L 2224/05166 (2013.01 - EP US); H01L 2224/05552 (2013.01 - EP US); H01L 2224/05554 (2013.01 - EP); H01L 2224/05644 (2013.01 - EP US); H01L 2224/05655 (2013.01 - EP US); H01L 2224/0603 (2013.01 - EP US); H01L 2224/06051 (2013.01 - EP US); H01L 2224/45124 (2013.01 - EP US); H01L 2224/45144 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/4813 (2013.01 - EP US); H01L 2224/4846 (2013.01 - EP US); H01L 2224/48463 (2013.01 - EP US); H01L 2224/4847 (2013.01 - EP US); H01L 2224/48644 (2013.01 - EP US); H01L 2224/48655 (2013.01 - EP US); H01L 2224/48755 (2013.01 - EP US); H01L 2224/49111 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01014 (2013.01 - EP US); H01L 2924/01015 (2013.01 - EP US); H01L 2924/01022 (2013.01 - EP US); H01L 2924/01023 (2013.01 - EP US); H01L 2924/01028 (2013.01 - EP US); H01L 2924/0103 (2013.01 - EP US); H01L 2924/01072 (2013.01 - EP US); H01L 2924/01075 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/05042 (2013.01 - EP US); H01L 2924/10162 (2013.01 - EP US); H01L 2924/1305 (2013.01 - EP US); H01L 2924/13055 (2013.01 - EP US); H01L 2924/1306 (2013.01 - EP US); H01L 2924/13091 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/19043 (2013.01 - EP US)
Designated contracting state (EPC)
DE IT NL
DOCDB simple family (publication)
EP 0720234 A2 19960703; EP 0720234 A3 19970910; EP 0720234 B1 20060308; DE 69534838 D1 20060504; DE 69534838 T2 20061012; JP H08255911 A 19961001; US 5665996 A 19970909; US 6043125 A 20000328; US 6066877 A 20000523
DOCDB simple family (application)
EP 95309537 A 19951229; DE 69534838 T 19951229; JP 35391695 A 19951228; US 36748694 A 19941230; US 77917697 A 19970106; US 96655397 A 19971110