Global Patent Index - EP 0720663 B1

EP 0720663 B1 19970611 - METHOD FOR DIMENSIONING AN ELECTROPLATING ENCLOSURE WITH A MAGNETIC WIPING DEVICE FOR ELECTROPLATED METALLURGICAL PRODUCTS

Title (en)

METHOD FOR DIMENSIONING AN ELECTROPLATING ENCLOSURE WITH A MAGNETIC WIPING DEVICE FOR ELECTROPLATED METALLURGICAL PRODUCTS

Title (de)

DIMENSIONIERUNG EINES BESCHICHTUNGSBEHAELTERS MIT EINER MAGNETISCHEN WISCHVORRICHTUNG VON MIT FLUSSIGEM METALL BESCHICHTETEN METALLURGISCHEN MATERIALEN

Title (fr)

PROCEDE DE DIMENSIONNEMENT D'UNE ENCEINTE DE GALVANISATION POURVUE D'UN DISPOSITIF D'ESSUYAGE MAGNETIQUE DE PRODUITS METALLURGIQUES GALVANISES

Publication

EP 0720663 B1 19970611 (FR)

Application

EP 94922281 A 19940720

Priority

  • CN 94193846 A 19940720
  • FR 9400907 W 19940720
  • FR 9300524 A 19930120

Abstract (en)

[origin: WO9602684A1] A method for dimensioning an electroplating enclosure with a device for magnetically wiping electroplated metallurgical products, particularly applicable to a continuous electroplating method. The method uses a wiping device which is preferably an inductive element arranged about an outlet channel of the enclosure in order to generate a transversal alternating sliding electromagnetic field at the surface of said products. Said method is characterised in that it comprises, mainly on the basis of the transversal dimensions and axial length of said enclosure, the cross section and velocity of the products, the dynamic viscosity and pressure of the coating fluid within the enclosure, the transversal dimensions of said outlet channel, the displacement speed and magnitude of the electromagnetic field in said liquid, and a parameter representative of the roughness, if any, of said metallurgical products, calculating or controlling the conditions in which the Couette lengths respectively associated with the flow of the coating fluid within the enclosure and in its outlet channel, are maintained below the critical values beyond which said flows become markedly turbulent.

IPC 1-7

C23C 2/24

IPC 8 full level

C23C 2/24 (2006.01)

CPC (source: EP)

C23C 2/24 (2013.01)

Designated contracting state (EPC)

AT BE CH DE DK ES GB IE IT LI LU NL PT SE

DOCDB simple family (publication)

FR 2700555 A1 19940722; FR 2700555 B1 19950331; AT E154399 T1 19970615; AU 693106 B2 19980625; AU 7346394 A 19960216; BR 9407692 A 19970204; CN 1070931 C 20010912; CN 1133618 A 19961016; DE 69403810 D1 19970717; DE 69403810 T2 19980129; EP 0720663 A1 19960710; EP 0720663 B1 19970611; ES 2105736 T3 19971016; JP H09507531 A 19970729; PL 186566 B1 20040130; PL 313517 A1 19960708; RU 2119971 C1 19981010; WO 9602684 A1 19960201

DOCDB simple family (application)

FR 9300524 A 19930120; AT 94922281 T 19940720; AU 7346394 A 19940720; BR 9407692 A 19940720; CN 94193846 A 19940720; DE 69403810 T 19940720; EP 94922281 A 19940720; ES 94922281 T 19940720; FR 9400907 W 19940720; JP 50473796 A 19940720; PL 31351794 A 19940720; RU 96107898 A 19940720