Global Patent Index - EP 0726330 A1

EP 0726330 A1 19960814 - Heat sinks and process for producing the same

Title (en)

Heat sinks and process for producing the same

Title (de)

Wärmesenken und Herstellungsprozess

Title (fr)

Dissipateurs de chaleur et procédé de fabrication

Publication

EP 0726330 A1 19960814 (EN)

Application

EP 95104627 A 19950329

Priority

JP 2313695 A 19950210

Abstract (en)

Provided is a heat sink (1) which has excellent processability and is economical, even though it employs diamond, as well as, a process for producing the same. The heat sink (1) is molded using a composition obtained by adding a diamond powder (3) consisting of 0.1 to 100 mu m high-purity diamond particles to cemented carbide (2) consisting primarily of WC and, as the rest, at least one metal selected from Co, Ni and Fe and inevitable impurity. The proportion of the diamond powder (3) admixed relative to the cemented carbide (2) is preferably 5 to 90 %, and the diamond heat sink (1) is produced by sintering the particulate mixture of diamond, WC, Co, etc. at a temperature of 1200 to 1500 DEG C under a pressure of 3 to 6 GPa. <IMAGE>

IPC 1-7

C22C 26/00; H01L 23/373

IPC 8 full level

C22C 26/00 (2006.01); H01L 23/373 (2006.01)

CPC (source: EP KR US)

C22C 26/00 (2013.01 - EP US); H01L 23/373 (2013.01 - KR); H01L 23/3732 (2013.01 - EP US); H01L 23/3733 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); Y10S 165/905 (2013.01 - EP US); Y10T 428/252 (2015.01 - EP US); Y10T 428/256 (2015.01 - EP US); Y10T 428/30 (2015.01 - EP US)

C-Set (source: EP US)

H01L 2924/0002 + H01L 2924/00

Citation (search report)

  • [X] US 4466938 A 19840821 - GIGL PAUL D [US], et al
  • [A] PATENT ABSTRACTS OF JAPAN vol. 010, no. 318 (C - 381) 29 October 1986 (1986-10-29)
  • [A] PATENT ABSTRACTS OF JAPAN vol. 008, no. 102 (C - 222) 12 May 1984 (1984-05-12)
  • [A] PATENT ABSTRACTS OF JAPAN vol. 010, no. 353 (M - 539) 28 November 1986 (1986-11-28)

Designated contracting state (EPC)

AT BE CH DE DK ES FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

EP 0726330 A1 19960814; JP H08222669 A 19960830; KR 960032700 A 19960917; TW 268147 B 19960111; US 5786075 A 19980728

DOCDB simple family (application)

EP 95104627 A 19950329; JP 2313695 A 19950210; KR 19950006338 A 19950324; TW 84102346 A 19950313; US 41239195 A 19950328