EP 0728224 A4 19971022 - APPARATUS FOR A THIN FILM MANUFACTURING
Title (en)
APPARATUS FOR A THIN FILM MANUFACTURING
Title (de)
VORRICHTUNG FÜR DÜNNFILMHERSTELLUNG
Title (fr)
APPAREIL DESTINE A LA FABRICATION D'UNE COUCHE MINCE
Publication
Application
Priority
- KR 19940022171 A 19940903
- US 9511039 W 19950829
Abstract (en)
[origin: WO9607769A1] An apparatus for manufacturing a thin film for a semiconductor device which includes a vacuum chamber (22), a heater block (23) installed in the vacuum chamber (22) for heating the wafer (200), asputtering source (24) installed above the heater block (23), a clamp (26) for clamping the wafer (200) installed on the heater block (23) against the heater block (23), and a gas supply means (40) for directly supplying gas to two specific sites in the vacuum chamber (22) which comprises a first gas supply (41) for supplying a first gas proximate the top of the wafer (200) from an opening (44) formed along the exterior surface of the sputtering source (24), and a second gas supply (45) positioned to supply a second gas to the top of the wafer (200). The present invention reduces the formation of undesirable particles in the vacuum chamber (22) thereby improving the characteristics of the deposited film and production efficiency.
IPC 1-7
IPC 8 full level
C23C 14/34 (2006.01); C23C 14/00 (2006.01); H01J 37/34 (2006.01); H01L 21/203 (2006.01)
CPC (source: EP)
C23C 14/0063 (2013.01); H01J 37/3244 (2013.01); H01J 37/34 (2013.01); H01J 2237/022 (2013.01)
Citation (search report)
- No further relevant documents disclosed
- See references of WO 9607769A1
Designated contracting state (EPC)
CH DE GB LI
DOCDB simple family (publication)
WO 9607769 A1 19960314; EP 0728224 A1 19960828; EP 0728224 A4 19971022; JP H09505356 A 19970527
DOCDB simple family (application)
US 9511039 W 19950829; EP 95931033 A 19950829; JP 50957096 A 19950829