EP 0736225 A1 19961009 - METHOD OF ATTACHING INTEGRATED CIRCUIT DIES BY ROLLING ADHESIVES ONTO SEMICONDUCTOR WAFERS
Title (en)
METHOD OF ATTACHING INTEGRATED CIRCUIT DIES BY ROLLING ADHESIVES ONTO SEMICONDUCTOR WAFERS
Title (de)
VERFAHREN ZUR BEFESTIGUNG VON IC-CHIPS DURCH ABROLLEN VON KLEBSTOFF AUF HALBLEITERWAFER
Title (fr)
PROCEDE DE FIXATION DE PUCES DE CIRCUIT INTEGRE CONSISTANT A APPLIQUER A L'AIDE D'UN CYLINDRE DES ADHESIFS SUR DES TRANCHES DE SEMI-CONDUCTEURS
Publication
Application
Priority
- US 9514196 W 19951017
- US 32676994 A 19941020
Abstract (en)
[origin: WO9613066A1] A method of attaching an integrated circuit die (182) to a support surface (188) is disclosed. An adhesive (164) is rolled onto a surface of a semiconductor wafer (160) using a roller to form an adhesive coating (164) on the semiconductor wafer surface. The adhesive coating (164) is dried, and the semiconductor wafer (160) is diced to form several integrated circuit dies (182) each having an integrated circuit and an adhesive layer (184) that constitutes a portion of the adhesive coating. One of the dies (182) is attached to a die attach pad (188) by placing the die's adhesive layer (184) in contact with the pad (188) which is then cured. A packaged integrated circuit (180) containing a die (182) with an adhesive layer (184) is also described.
IPC 1-7
IPC 8 full level
H01L 21/58 (2006.01); H01L 21/68 (2006.01); H01L 23/495 (2006.01)
CPC (source: EP)
H01L 21/6836 (2013.01); H01L 23/49513 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/274 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83048 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/83856 (2013.01); H01L 2224/8388 (2013.01); H01L 2224/94 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01021 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01)
Citation (search report)
See references of WO 9613066A1
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
DOCDB simple family (application)
US 9514196 W 19951017; EP 95939026 A 19951017