EP 0737133 B1 19980729 - THERMAL PROCESS FOR APPLYING HYDROPHILIC LAYERS ON HYDROPHOBIC SUBSTRATES AND USE OF THUS COATED SUBSTRATES AS CARRIERS FOR OFFSET PRINTING PLATES
Title (en)
THERMAL PROCESS FOR APPLYING HYDROPHILIC LAYERS ON HYDROPHOBIC SUBSTRATES AND USE OF THUS COATED SUBSTRATES AS CARRIERS FOR OFFSET PRINTING PLATES
Title (de)
THERMISCHES AUFTRAGSVERFAHREN FÜR HYDROPHILE SCHICHTEN AUF HYDROPHOBEN SUBSTRATEN UND VERWENDUNG SO BESCHICHTETER SUBSTRATE ALS TRÄGERKÖRPER FÜR OFFSETDRUCKPLATTEN
Title (fr)
PROCEDE D'APPLICATION THERMIQUE DE COUCHES HYDROPHILES SUR DES SUBSTRATS HYDROPHOBES ET UTILISATION DES SUBSTRATS AINSI REVETUS COMME SUPPORTS DE PLAQUES OFFSET
Publication
Application
Priority
- DE 4344692 A 19931227
- DE 4401059 A 19940115
- EP 9404218 W 19941219
Abstract (en)
[origin: US5967047A] PCT No. PCT/EP94/04218 Sec. 371 Date Sep. 20, 1996 Sec. 102(e) Date Sep. 20, 1996 PCT Filed Dec. 19, 1994 PCT Pub. No. WO95/18019 PCT Pub. Date Jul. 6, 1995This invention relates to a process for preparing printing plates which are used in offset printing. The process produces a plate which comprises a substrate film in which a thin durable hydrophilic layer has been applied thereto. In the process, the substrate film is first microroughened by pressure blasting so that the surface roughness, RA, is in the range 0.3 to 1.5 mu m. Subsequently, a durable, firmly adhering hydrophilic layer is applied to substrate by plasma-spraying an oxide powder with a particle size of 1 to 40 mu m onto the substrate. This process produces a plate whose surface is not greasy or grainy.
IPC 1-7
IPC 8 full level
B41C 1/10 (2006.01); B41N 1/00 (2006.01); B41N 1/08 (2006.01); B41N 1/14 (2006.01); B41N 3/03 (2006.01); B41N 3/04 (2006.01); C08J 7/00 (2006.01); C23C 4/02 (2006.01); C23C 4/06 (2006.01); C23C 4/10 (2006.01); C23C 4/14 (2006.01)
CPC (source: EP US)
B41N 1/006 (2013.01 - EP US); B41N 3/032 (2013.01 - EP US); C23C 4/02 (2013.01 - EP US); C23C 4/06 (2013.01 - EP US); C23C 4/11 (2016.01 - EP US); C23C 4/14 (2013.01 - EP US)
Designated contracting state (EPC)
BE DE FR GB IT NL
DOCDB simple family (publication)
US 5967047 A 19991019; AU 1316395 A 19950717; DE 59406576 D1 19980903; EP 0737133 A1 19961016; EP 0737133 B1 19980729; JP 3402368 B2 20030506; JP H09504241 A 19970428; WO 9518019 A1 19950706
DOCDB simple family (application)
US 66629296 A 19960920; AU 1316395 A 19941219; DE 59406576 T 19941219; EP 9404218 W 19941219; EP 95904503 A 19941219; JP 51776095 A 19941219