EP 0737588 A4 19970326 - THERMAL HEAD AND METHOD OF MANUFACTURING SAME
Title (en)
THERMAL HEAD AND METHOD OF MANUFACTURING SAME
Title (de)
THERMO-KOPF UND SEIN HERSTELLUNGSVERFAHREN
Title (fr)
TETE THERMIQUE ET PROCEDE DE FABRICATION
Publication
Application
Priority
- JP 9502191 W 19951025
- JP 26742494 A 19941031
Abstract (en)
[origin: US6253447B1] A method for manufacturing a thermal head comprises forming a heat generating resistor on an insulative substrate, and disposing conductors having different material properties on the heat generating resistor for supplying power to the heat generating resistor. The conductors are then etched to form a wiring electrode having a tapered peripheral edge portion as a result of the different material properties of the conductors. A protective film is then formed over the heat generating resistor and the wiring electrode.
IPC 1-7
IPC 8 full level
B41J 2/335 (2006.01); B41J 2/345 (2006.01)
CPC (source: EP US)
B41J 2/3351 (2013.01 - EP US); B41J 2/3353 (2013.01 - EP US); B41J 2/3355 (2013.01 - EP US); B41J 2/3357 (2013.01 - EP US); B41J 2/3359 (2013.01 - EP US); B41J 2/345 (2013.01 - EP US); Y10T 29/49083 (2015.01 - EP US); Y10T 29/49401 (2015.01 - EP US)
Citation (search report)
- [Y] EP 0299735 A2 19890118 - TOKYO ELECTRIC CO LTD [JP]
- [XAY] US 4096510 A 19780620 - ARAI SHOJI, et al
- [XA] US 4719477 A 19880112 - HESS ULRICH E [US]
- [Y] PATENT ABSTRACTS OF JAPAN vol. 6, no. 83 (M - 130) 21 May 1982 (1982-05-21)
- [A] PATENT ABSTRACTS OF JAPAN vol. 18, no. 272 (M - 1610) 24 May 1994 (1994-05-24)
- [YA] PATENT ABSTRACTS OF JAPAN vol. 3, no. 40 (E - 102) 6 April 1979 (1979-04-06)
- [A] PATENT ABSTRACTS OF JAPAN vol. 13, no. 244 (M - 834)<3592> 7 June 1989 (1989-06-07)
- [A] PATENT ABSTRACTS OF JAPAN vol. 14, no. 196 (M - 964)<4139> 20 April 1990 (1990-04-20)
- [A] PATENT ABSTRACTS OF JAPAN vol. 7, no. 159 (M - 228)<1304> 13 July 1983 (1983-07-13)
Designated contracting state (EPC)
DE FR IT
DOCDB simple family (publication)
US 6253447 B1 20010703; DE 69515637 D1 20000420; DE 69515637 T2 20001109; EP 0737588 A1 19961016; EP 0737588 A4 19970326; EP 0737588 B1 20000315; JP 2844051 B2 19990106; JP H08127143 A 19960521; KR 100354622 B1 20021228; US 5940110 A 19990817; WO 9613389 A1 19960509
DOCDB simple family (application)
US 27031899 A 19990316; DE 69515637 T 19951025; EP 95935562 A 19951025; JP 26742494 A 19941031; JP 9502191 W 19951025; KR 19960703531 A 19960629; US 66929996 A 19960715