EP 0738456 A1 19961023 - METHOD OF PRODUCING A FEEDTHROUGH ON A CIRCUIT BOARD
Title (en)
METHOD OF PRODUCING A FEEDTHROUGH ON A CIRCUIT BOARD
Title (de)
VERFAHREN ZUR HERSTELLUNG EINER DURCHKONTAKTIERUNG AUF EINER LEITERPLATTE
Title (fr)
PROCEDE DE REALISATION D'UNE TRAVERSEE DANS UNE PLAQUETTE A CIRCUIT IMPRIME
Publication
Application
Priority
- DE 9501497 W 19951027
- DE 4439948 A 19941109
Abstract (en)
[origin: US5799393A] PCT No. PCT/DE95/01497 Sec. 371 Date Sep. 23, 1996 Sec. 102(e) Date Sep. 23, 1996 PCT Filed Oct. 27, 1995 PCT Pub. No. WO96/15651 PCT Pub. Date May 23, 1996A method for producing a plated-through hole on a printed-circuit board, whereby the printed-circuit board is initially bored, catalyzed, and patterned. The plated-through hole is then fashioned in an electrochemical deposition process so as to make it functional for the through-hole mounting of electrical components. The plating process is preferably carried out with nickel or nickel compounds, so that no additional corrosion protection is required. A direct bonding to the contact lands can be achieved by coating the contact lands with gold or palladium.
IPC 1-7
IPC 8 full level
H05K 3/24 (2006.01); H05K 3/42 (2006.01); H05K 3/34 (2006.01); H05K 3/40 (2006.01)
CPC (source: EP US)
H05K 3/244 (2013.01 - EP US); H05K 3/428 (2013.01 - EP US); H05K 3/243 (2013.01 - EP US); H05K 3/3452 (2013.01 - EP US); H05K 3/4007 (2013.01 - EP US); H05K 2201/0344 (2013.01 - EP US); H05K 2203/0571 (2013.01 - EP US); H05K 2203/1423 (2013.01 - EP US); Y10T 29/49165 (2015.01 - EP US)
Citation (search report)
See references of WO 9615651A1
Designated contracting state (EPC)
AT BE CH DE ES FR GB IT LI NL SE
DOCDB simple family (publication)
US 5799393 A 19980901; DE 19541495 A1 19960515; EP 0738456 A1 19961023; JP H09507969 A 19970812; TW 310521 B 19970711; WO 9615651 A1 19960523
DOCDB simple family (application)
US 66933096 A 19960923; DE 19541495 A 19951108; DE 9501497 W 19951027; EP 95935814 A 19951027; JP 51562996 A 19951027; TW 84111514 A 19951101