Global Patent Index - EP 0738561 B1

EP 0738561 B1 2002-01-23 - Apparatus and method for in-situ endpoint detection and monitoring for chemical mechanical polishing operations

Title (en)

Apparatus and method for in-situ endpoint detection and monitoring for chemical mechanical polishing operations

Title (de)

Verfahren und Vorrichtung zur In-Situ-Kontroll und Bestimmung des Endes von chemisch-mechanischen Planiervorgänge

Title (fr)

Procédé et dispositif pour le contrôle et la détection in-situ de la fin d'une opération de polissage mécano-chimique

Publication

EP 0738561 B1 (EN)

Application

EP 96302176 A

Priority

  • US 41398295 A
  • US 60576996 A

Abstract (en)

[origin: EP0738561A1] The disclosure relates to an apparatus for chemical mechanical polishing (CMP) of a wafer, comprising: a rotatable polishing patent (16) with an overlying polishing pad (18) wetted with an abrasive slurry, the platen being rotatably mounted to a chassis; a rotatable polishing head (12) for holding the wafer (14) against the polishing pad, the wafer comprising a semiconductor substrate underlying an oxide layer; and an endpoint detector. The detector comprises a laser interferometer (32) capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window (38) disposed adjacent a hole (30) formed through the platen, the window providing a pathway for the laser beam to impinge on the wafer at least during part of a period of time when the wafer overlies the window. <IMAGE>

IPC 1-7

B24B 37/04; B24B 47/12; B24D 7/12; G01B 11/06

IPC 8 full level

B24B 37/013 (2012.01); B24B 37/20 (2012.01); B24B 47/12 (2006.01); B24B 49/02 (2006.01); B24B 49/04 (2006.01); B24B 49/12 (2006.01); B24B 51/00 (2006.01); B24D 7/12 (2006.01); B24D 13/14 (2006.01); G01B 11/06 (2006.01); H01L 21/304 (2006.01)

CPC

B24B 37/205 (2013.01); B24B 37/013 (2013.01); B24B 47/12 (2013.01); B24B 49/04 (2013.01); B24B 49/12 (2013.01); B24B 51/00 (2013.01); G01B 11/06 (2013.01); G01B 11/0683 (2013.01)

Citation (examination)

EP 0846040 A1 19980610 - RODEL INC [US]

Designated contracting state (EPC)

DE FR GB IT NL

DOCDB simple family

EP 0738561 A1 19961023; EP 0738561 B1 20020123; DE 69618698 T2 20020814; DE 69632490 T2 20050512; DE 69635816 T2 20061012; JP 2004006663 A 20040108; JP 2004048051 A 20040212; JP 3431115 B2 20030728; JP 3510622 B2 20040329; JP H097985 A 19970110; KR 100542474 B1 20060104; US 2008227367 A1 20080918; US 2010240281 A1 20100923; US 2011070808 A1 20110324; US 2012107971 A1 20120503; US 2014038501 A1 20140206; US 7731566 B2 20100608; US 7841926 B2 20101130; US 8092274 B2 20120110; US 8556679 B2 20131015