Global Patent Index - EP 0741409 A3

EP 0741409 A3 19970611 - Heat sink for semiconductor devices

Title (en)

Heat sink for semiconductor devices

Title (de)

Kühlkörper für Halbleiterbauelemente

Title (fr)

Dissipateur de chaleur pour des dispositifs semi-conducteurs

Publication

EP 0741409 A3 19970611 (DE)

Application

EP 96810261 A 19960424

Priority

DE 29507286 U 19950504

Abstract (en)

[origin: US5950721A] Heat exchanger for cooling semi-conductor components or the like equipment features cooling fins that are spaced apart, attached to and project out from a base section of extruded aluminum or another light metal, each fin being secured in a groove or the like recess in the base section, The cooling fins are in the form of cooling-fin plates made of thin-gauge strips of material and, as viewed in longitudinal cross-section, are profiled at least in the region where they join the base section.

IPC 1-7

H01L 23/367; H01L 21/48

IPC 8 full level

F28F 3/02 (2006.01); F28F 3/04 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01); H05K 7/20 (2006.01)

CPC (source: EP US)

F28F 3/02 (2013.01 - EP US); F28F 3/04 (2013.01 - EP US); F28F 3/048 (2013.01 - EP US); H01L 23/3672 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); Y10T 29/4935 (2015.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

AT BE DE DK ES FR GB GR IE IT NL PT SE

DOCDB simple family (publication)

US 5950721 A 19990914; AT E207242 T1 20011115; DE 29507286 U1 19950720; DE 59607913 D1 20011122; DK 0741409 T3 20020211; EP 0741409 A2 19961106; EP 0741409 A3 19970611; EP 0741409 B1 20011017; ES 2162011 T3 20011216; PT 741409 E 20020228; TR 199600281 A2 19961121; US 6234246 B1 20010522

DOCDB simple family (application)

US 91518797 A 19970820; AT 96810261 T 19960424; DE 29507286 U 19950504; DE 59607913 T 19960424; DK 96810261 T 19960424; EP 96810261 A 19960424; ES 96810261 T 19960424; PT 96810261 T 19960424; TR 9600281 A 19960403; US 62880596 A 19960405