Global Patent Index - EP 0742854 B1

EP 0742854 B1 20020918 - CHIP BIN ASSEMBLY

Title (en)

CHIP BIN ASSEMBLY

Title (de)

HACKSCHNITZELSILO

Title (fr)

TREMIE A COPEAUX

Publication

EP 0742854 B1 20020918 (EN)

Application

EP 95909253 A 19950117

Priority

  • US 9500616 W 19950117
  • US 18954694 A 19940201
  • US 36658194 A 19941230

Abstract (en)

[origin: WO9521287A1] A chip bin construction, ideally suited for bins having a maximum diameter of twelve feet or more, uniformly discharges chips, after steaming, without the necessity of a vibratory discharge. A hollow transition portion is provided between a main body which is a right circular cylinder of a first diameter, and a nonvibrating discharge which has a second diameter typically 1/3 or less that of the first diameter. The hollow transition includes a first, uppermost, portion having a generally right rectangular parallelepiped configuration including opposite side faces having generally triangular shapes, and providing one dimensional convergence and side relief; a second portion tapering from a generally rectangular parallelepiped configuration at an upper part to a generally circular configuration at a lower part and having opposite side faces having generally triangular shapes which align with said first portion generally triangular shapes to define substantially diamond shaped wall portions. Also, there preferably is provided a third portion substantially the same as the first portion, only smaller, and connected to the second portion lower part; and a fourth, lowermost, portion substantially the same as the second portion only smaller, and connected to the third portion and discharge. Steam is introduced into the main body and the hollow transition, such as through steam conduits in the generally triangular shaped faces of the second portion of the hollow transition. Air blasters are mounted where appropriate in the hollow transition to break up chip hangups.

IPC 1-7

D21C 7/06; B65D 88/64

IPC 8 full level

B65D 88/64 (2006.01); B65D 88/68 (2006.01); D21C 7/06 (2006.01)

CPC (source: EP)

D21C 7/06 (2013.01)

Designated contracting state (EPC)

DE ES FR PT SE

DOCDB simple family (publication)

WO 9521287 A1 19950810; AU 1727995 A 19950821; BR 9506682 A 19971118; CA 2181892 A1 19950810; CA 2181892 C 20010724; CN 1048778 C 20000126; CN 1139968 A 19970108; DE 69528252 D1 20021024; DE 69528252 T2 20030508; EP 0742854 A1 19961120; EP 0742854 B1 20020918; ES 2182889 T3 20030316; FI 119329 B 20081015; FI 963000 A0 19960729; FI 963000 A 19960930; JP 2991500 B2 19991220; JP H09507536 A 19970729; PT 742854 E 20030131; RU 2124600 C1 19990110

DOCDB simple family (application)

US 9500616 W 19950117; AU 1727995 A 19950117; BR 9506682 A 19950117; CA 2181892 A 19950117; CN 95191451 A 19950117; DE 69528252 T 19950117; EP 95909253 A 19950117; ES 95909253 T 19950117; FI 963000 A 19960729; JP 52062995 A 19950117; PT 95909253 T 19950117; RU 96117654 A 19950117