Global Patent Index - EP 0742854 B1

EP 0742854 B1 2002-09-18 - CHIP BIN ASSEMBLY

Title (en)

CHIP BIN ASSEMBLY

Title (de)

HACKSCHNITZELSILO

Title (fr)

TREMIE A COPEAUX

Publication

EP 0742854 B1 (EN)

Application

EP 95909253 A

Priority

  • US 9500616 W
  • US 18954694 A
  • US 36658194 A

Abstract (en)

[origin: WO9521287A1] A chip bin construction, ideally suited for bins having a maximum diameter of twelve feet or more, uniformly discharges chips, after steaming, without the necessity of a vibratory discharge. A hollow transition portion is provided between a main body which is a right circular cylinder of a first diameter, and a nonvibrating discharge which has a second diameter typically 1/3 or less that of the first diameter. The hollow transition includes a first, uppermost, portion having a generally right rectangular parallelepiped configuration including opposite side faces having generally triangular shapes, and providing one dimensional convergence and side relief; a second portion tapering from a generally rectangular parallelepiped configuration at an upper part to a generally circular configuration at a lower part and having opposite side faces having generally triangular shapes which align with said first portion generally triangular shapes to define substantially diamond shaped wall portions. Also, there preferably is provided a third portion substantially the same as the first portion, only smaller, and connected to the second portion lower part; and a fourth, lowermost, portion substantially the same as the second portion only smaller, and connected to the third portion and discharge. Steam is introduced into the main body and the hollow transition, such as through steam conduits in the generally triangular shaped faces of the second portion of the hollow transition. Air blasters are mounted where appropriate in the hollow transition to break up chip hangups.

IPC 1-7 (main, further and additional classification)

D21C 7/06; B65D 88/64

IPC 8 full level (invention and additional information)

B65D 88/68 (2006.01); B65D 88/64 (2006.01); D21C 7/06 (2006.01)

CPC (invention and additional information)

D21C 7/06 (2013.01)

Designated contracting state (EPC)

DE ES FR PT SE

EPO simple patent family

WO 9521287 A1 19950810; AU 1727995 A 19950821; BR 9506682 A 19971118; CA 2181892 A1 19950810; CA 2181892 C 20010724; CN 1048778 C 20000126; CN 1139968 A 19970108; DE 69528252 D1 20021024; DE 69528252 T2 20030508; EP 0742854 A1 19961120; EP 0742854 B1 20020918; ES 2182889 T3 20030316; FI 119329 B 20081015; FI 963000 A0 19960729; FI 963000 A 19960930; JP 2991500 B2 19991220; JP H09507536 A 19970729; PT 742854 E 20030131; RU 2124600 C1 19990110

INPADOC legal status


2015-04-30 [PG25 ES] LAPSED IN A CONTRACTING STATE ANNOUNCED VIA POSTGRANT INFORM. FROM NAT. OFFICE TO EPO

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- Free text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION

- Effective date: 20150118

2015-04-30 [PG25 PT] LAPSED IN A CONTRACTING STATE ANNOUNCED VIA POSTGRANT INFORM. FROM NAT. OFFICE TO EPO

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- Free text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION

- Effective date: 20150126

2015-03-27 [REG ES FD2A] ANNOUNCEMENT OF LAPSE IN SPAIN

- Effective date: 20150327

2015-03-03 [REG SE EUG] EUROPEAN PATENT HAS LAPSED

2015-01-26 [REG PT MM4A] ANNULMENT/LAPSE DUE TO NON-PAYMENT OF FEES, SEARCHED AND EXAMINED PATENT

- Free text: MAXIMUM VALIDITY LIMIT REACHED

- Effective date: 20150117

2015-01-20 [REG DE R071] EXPIRY OF RIGHT

- Document: DE 69528252

2014-05-30 [PGFP ES] POSTGRANT: ANNUAL FEES PAID TO NATIONAL OFFICE

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- Payment date: 20140123

- Year of fee payment: 20

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2003-09-10 [26N] NO OPPOSITION FILED

- Effective date: 20030619

2003-03-16 [REG ES FG2A] DEFINITIVE PROTECTION

- Document: ES 2182889 T3

2003-03-14 [ET] FR: TRANSLATION FILED

2003-01-31 [REG PT SC4A] TRANSLATION IS AVAILABLE

- Free text: AVAILABILITY OF NATIONAL TRANSLATION

- Effective date: 20021212

2002-10-24 [REF] CORRESPONDS TO:

- Document: DE 69528252 20021024

2002-09-18 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: B1

- Designated State(s): DE ES FR PT SE

2002-08-21 [RAP1] TRANSFER OF RIGHTS OF AN APPLICATION

- Owner name: ANDRITZ INC.

2002-04-17 [RAP1] TRANSFER OF RIGHTS OF AN APPLICATION

- Owner name: ANDRITZ INC.

2001-11-28 [RTI1] TITLE (CORRECTION)

- Free text: CHIP BIN ASSEMBLY

2001-11-21 [RTI1] TITLE (CORRECTION)

- Free text: CHIP BIN ASSEMBLY

2001-06-27 [RAP1] TRANSFER OF RIGHTS OF AN APPLICATION

- Owner name: ANDRITZ-AHLSTROM INC.

1997-01-15 [17Q] FIRST EXAMINATION REPORT

- Effective date: 19961203

1996-11-20 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 19960814

1996-11-20 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A1

- Designated State(s): DE ES FR PT SE