EP 0743680 A2 19961120 - A conductor paste for plugging through-holes in ceramic circuit boards
Title (en)
A conductor paste for plugging through-holes in ceramic circuit boards
Title (de)
Leitpaste zum Verschluss von Vias in keramischen Leiterplatten
Title (fr)
Pâte conductrice pour boucher des trous traversants dans des circuits imprimés
Publication
Application
Priority
JP 12126095 A 19950519
Abstract (en)
A conductor paste for plugging a through-hole in a ceramic substrate which includes an electrically conductive powder having a metal powder as its main component, a swelling agent and a vehicle, and may also include adhesion improvers. After sintering the conductor paste, a conductor plug is created which will not fall out of the through-hole, is resistant to chipping during the leveling process and may be gas impermeable. <IMAGE>
IPC 1-7
IPC 8 full level
H01L 23/498 (2006.01); H05K 1/09 (2006.01); H05K 3/40 (2006.01)
CPC (source: EP US)
H01L 23/49883 (2013.01 - EP US); H05K 1/092 (2013.01 - EP US); H01L 2224/16 (2013.01 - EP US); H01L 2924/0102 (2013.01 - EP US); H01L 2924/01046 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01322 (2013.01 - EP US); H05K 3/4061 (2013.01 - EP US); Y10T 428/12868 (2015.01 - EP US); Y10T 428/24926 (2015.01 - EP US); Y10T 428/252 (2015.01 - EP US); Y10T 428/256 (2015.01 - EP US)
Designated contracting state (EPC)
DE FR NL
DOCDB simple family (publication)
EP 0743680 A2 19961120; EP 0743680 A3 19980401; EP 0743680 B1 20031015; DE 69630332 D1 20031120; DE 69630332 T2 20040729; US 5698015 A 19971216; US 5922245 A 19990713
DOCDB simple family (application)
EP 96302146 A 19960328; DE 69630332 T 19960328; US 62266396 A 19960326; US 92266797 A 19970903