EP 0745456 A1 19961204 - Polishing peripheral portions of wafers
Title (en)
Polishing peripheral portions of wafers
Title (de)
Polieren der Randbereiche von Wafers
Title (fr)
Polissage des parties périphériques de wafers
Publication
Application
Priority
JP 15381395 A 19950529
Abstract (en)
A method and apparatus for mirror-polishing a peripheral portion of a wafer (W) carries out a first polishing step (2, 12, 13, 14) for polishing the peripheral portion of the wafer (W) by using tape (T) having abrasive grains thereon, and a second polishing step (3) for thereafter polishing the peripheral portion of the wafer (W) by using a buff (22, 23, 24) with an abrasive material. <IMAGE>
IPC 1-7
IPC 8 full level
B24B 9/06 (2006.01)
CPC (source: EP KR)
B24B 9/065 (2013.01 - EP); H01L 21/304 (2013.01 - KR)
Citation (search report)
- [Y] EP 0646436 A1 19950405 - SHINETSU HANDOTAI KK [JP], et al
- [Y] EP 0584905 A1 19940302 - SHINETSU HANDOTAI KK [JP]
- [T] EP 0720891 A1 19960710 - SHINETSU HANDOTAI KK [JP], et al
- [A] EP 0650804 A1 19950503 - SHINETSU HANDOTAI KK [JP], et al
- [A] EP 0633097 A1 19950111 - SHINETSU HANDOTAI KK [JP], et al
- [A] PATENT ABSTRACTS OF JAPAN vol. 7, no. 29 (M - 191) 5 February 1983 (1983-02-05)
- [AP] PATENT ABSTRACTS OF JAPAN vol. 95, no. 10 30 November 1995 (1995-11-30)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0745456 A1 19961204; EP 0745456 B1 20010919; DE 69615273 D1 20011025; DE 69615273 T2 20020627; KR 960043006 A 19961221; TW 303487 B 19970421
DOCDB simple family (application)
EP 96303484 A 19960516; DE 69615273 T 19960516; KR 19960019606 A 19960528; TW 85105672 A 19960514