EP 0745456 B1 20010919 - Polishing peripheral portions of wafers
Title (en)
Polishing peripheral portions of wafers
Title (de)
Polieren der Randbereiche von Wafers
Title (fr)
Polissage des parties périphériques de wafers
Publication
Application
Priority
JP 15381395 A 19950529
Abstract (en)
[origin: EP0745456A1] A method and apparatus for mirror-polishing a peripheral portion of a wafer (W) carries out a first polishing step (2, 12, 13, 14) for polishing the peripheral portion of the wafer (W) by using tape (T) having abrasive grains thereon, and a second polishing step (3) for thereafter polishing the peripheral portion of the wafer (W) by using a buff (22, 23, 24) with an abrasive material. <IMAGE>
IPC 1-7
IPC 8 full level
B24B 9/06 (2006.01)
CPC (source: EP KR)
B24B 9/065 (2013.01 - EP); H01L 21/304 (2013.01 - KR)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0745456 A1 19961204; EP 0745456 B1 20010919; DE 69615273 D1 20011025; DE 69615273 T2 20020627; KR 960043006 A 19961221; TW 303487 B 19970421
DOCDB simple family (application)
EP 96303484 A 19960516; DE 69615273 T 19960516; KR 19960019606 A 19960528; TW 85105672 A 19960514